Method and System for Improving Performance and Preventing Corrosion in Multi-Module Cleaning Chamber

Abstract

A method and system for cleaning a substrate in a multi-module cleaning assembly is provided. The method begins by receiving the substrate into the cleaning module. A cleaning chemistry, at a temperature elevated from an ambient temperature, is applied onto a top surface of the substrate. Concurrent with application of the cleaning chemistry, vapors are exhausted from the cleaning chemistry through a port located below a bottom surface of the substrate with the vapor exhaustion providing a negative pressure relative to a pressure external to the cleaning module. The application of the cleaning chemistry is terminated, followed by termination of the exhausting of the vapors. The substrate is dried after the flowing of inert gas is terminated.

What is claimed is: 
     
         1 . A cleaning assembly, comprising:
 a bottom cleaning module for performing a spin-rinse-dry operation on a substrate, the bottom cleaning module having a base portion housing a chuck adapted for receiving the substrate;   a top cleaning module disposed over the bottom cleaning module, wherein a mid-portion of the cleaning assembly is operable as a base of the top cleaning module and a top of the bottom cleaning module;   a component located in the bottom cleaning module for applying a cleaning chemistry onto a top surface of the substrate, wherein the cleaning chemistry is at a temperature higher than ambient temperature; and   a port located in the bottom cleaning module below a bottom surface of the substrate and operably connected to a vacuum source for exhausting vapors while the cleaning chemistry is applied.   
     
     
         2 . The cleaning assembly of  claim 1  wherein the substrate is dried in the bottom cleaning module after terminating the applying of the cleaning chemistry and the exhausting of the vapors. 
     
     
         3 . The cleaning assembly of  claim 1  wherein the applying of the cleaning chemistry is terminated before the exhausting of the vapors is terminated. 
     
     
         4 . The cleaning assembly of  claim 1  wherein the port is configured as an annular ring disposed along a lower outer peripheral region of the bottom cleaning module. 
     
     
         5 . The cleaning assembly of  claim 1  wherein the vacuum source provides a low pressure, high conductance fluid flow below the substrate. 
     
     
         6 . The cleaning assembly of  claim 5  wherein the pressure of the fluid flow is maintained between about −0.1 to −0.7 inches water column. 
     
     
         7 . The cleaning assembly of  claim 1  wherein the component comprises at least one nozzle. 
     
     
         8 . The cleaning assembly of  claim 1  wherein the cleaning chemistry comprises de-ionized water delivered at a temperature of above 85 C. 
     
     
         9 . The cleaning assembly of  claim 5  wherein the conductance is maintained between about 1-60 cfm flow as measured at the port. 
     
     
         10 . The cleaning assembly of  claim 2  wherein the chuck is adapted for supporting and rotating the substrate when the substrate is being dried. 
     
     
         11 . The cleaning assembly of  claim 10  wherein the chuck is adapted for rotating the substrate at a rate of about 2000 rotations per minute or greater. 
     
     
         12 . The cleaning assembly of  claim 1  wherein the component is operably connected to a source of inert gas; and wherein the inert gas exiting the component creates an inert gas blanket above the top surface of the substrate. 
     
     
         13 . The cleaning assembly of  claim 1  further comprising an inlet located in the bottom cleaning module and operably connected to a source of inert gas, wherein the inert gas exiting the inlet creates an inert gas blanket above the top surface of the substrate. 
     
     
         14 . The cleaning assembly of  claim 13  wherein the inert gas blanket is created before the cleaning chemistry is applied. 
     
     
         15 . The cleaning assembly of  claim 1  wherein the chuck rotates the substrate to dry the substrate after an inert gas flow is terminated.