Transfer Chamber for Air-Sensitive Sample Processing

Abstract

A transfer chamber is disclosed having a first plate with a first surface configured to receive a sample and a second surface containing a groove. The second surface of the first plate surrounds the first surface of the first plate. A second plate has a first surface and a second surface containing a groove. A sealing component is disposed in the groove of the first plate or the second plate. A pivotable link couples the first plate and the second plate. The pivotable link is configured to hold the first plate, the second plate, and the sealing component together to substantially create an air-tight seal between the first surface of the first plate and the second surface of the second plate. The pivotable link is configured to open the seal in response to a pressure differential across the transfer chamber.

1 . An enclosure device, comprising:
 a first plate having a first surface configured to receive a sample and a second surface opposite the first surface;   a second plate having a first surface and a second surface opposite the first surface;   a sealing component disposed on one of the first surface of the first plate and the first surface of the second plate; and,   a pivotable link coupling the first plate to the second plate, the pivotable link configured to hold the first plate, the second plate, and the sealing component together to create an air-tight seal between the first surface of the first plate and the first surface of the second plate, and separate the first plate from the second plate when the pressure between the first surface of the first plate and the first surface of the second plate exceeds the pressure on the second surface of the first plate and the second surface of the second plate.   
     
     
         2 . The enclosure device of  claim 1 , wherein the sealing component is an O-ring. 
     
     
         3 . The enclosure device of  claim 1 , wherein the sample is within range of being processed by a means for sample processing when the enclosure device is opened. 
     
     
         4 . The enclosure device of  claim 1 , wherein the sample is not within range of being processed by a means for sample processing when the enclosure device is opened. 
     
     
         5 . The enclosure device of  claim 3 , wherein the sample is a metal substrate. 
     
     
         6 . The enclosure device of  claim 1 , wherein the pivotable link comprises a hinge rotatably coupling the second plate to the first plate. 
     
     
         7 . The enclosure device of  claim 5 , wherein the hinge further comprises a spring. 
     
     
         8 . The enclosure device of  claim 1 , wherein the pivotable link comprises a spindle about which one of the first plate and the second plate rotates and translates. 
     
     
         9 . The enclosure device of  claim 7 , wherein the pivotable link further comprises a spring. 
     
     
         10 . The enclosure device of  claim 8 , wherein the spring circumscribes the spindle and couples the first plate and the second plate. 
     
     
         11 . The enclosure device of  claim 9 , wherein the pivotable link further comprises a spring-loaded pin configured to translate one of the first plate and the second plate about the spindle. 
     
     
         12 . A method for sample processing, comprising:
 (a) closing a chamber comprising
 a first plate having an exterior surface and an interior surface, wherein the interior surface of the first plate is configured to hold a sample, 
 a second plate having an exterior surface and an interior surface, 
 sealing means disposed on the interior surface of one of the first plate and the second plate, 
 pivot means coupling the first plate to the second plate and about which the interior surface of the first plate sealingly engages the interior surface of the second plate in conjunction with the sealing means to form an air-tight seal; 
   (b) subjecting the chamber to a lower pressure on the exterior surface of the first plate and the second plate; and,   (c) displacing the second plate from the first plate about the pivot means to open the chamber.   
     
     
         13 . The method of  claim 12 , wherein the displacing step further includes rotating the second plate in a plane parallel to the interior surface of the first plate about the pivot means. 
     
     
         14 . The method of  claim 13 , wherein the displacing step further includes translating the second plate about the pivot means in a direction distal from and in a plane perpendicular to the interior surface of the first plate. 
     
     
         15 . The method of  claim 14 , wherein the rotating step comprises rotating the second plate about a spindle circumscribed by a spring wherein a torque induced by the spring rotates the second plate about the spindle. 
     
     
         16 . The method of  claim 15 , wherein the translating step comprises vertically shifting along a spindle circumscribed by a spring wherein the second plate moves distally from the first plate by an expansion of the spring. 
     
     
         17 . The method of  claim 15 , wherein the translating step comprises vertically shifting along a spindle the second plate distally from the first plate by an expansion of a spring-loaded pin coupled to one of the first and the second plates. 
     
     
         18 . The method of  claim 13 , wherein the displacing step comprises:
 (i) rotating the second plate in a plane parallel to the interior surface of the first plate about the pivot means; and,   (ii) translating the second plate about the pivot means in a direction distal from and in a plane perpendicular to the interior surface of the first plate.   
     
     
         19 . A method of sealing an atomic layer deposition transfer chamber, comprising the steps of:
 (a) pressurizing a first plate comprising a top surface and a bottom surface, the bottom surface comprising a plurality of legs and a second plate comprising a bottom surface, a mounting surface, and a sealing mechanism disposed on the mounting surface, the mounting surface configured to hold a sample, wherein the sealing mechanism forms an air-tight seal between the second plate and the bottom surface of the first plate via the sealing mechanism; and   (b) depressurizing the first plate and the second plate to decouple the second plate from the bottom surface of the first plate.   
     
     
         20 . The method of  claim 19 , wherein the maximum height from the top surface of the first plate to the ends of the plurality of legs is less than about  5  millimeters. 
     
     
         21 . The method of  claim 19 , wherein during the pressurizing step, the bottom surface of the second plate is suspended at least  1  millimeter from any other parallel surface. 
     
     
         22 . A device for creating an air-tight seal, comprising:
 a first plate having an outside and an inside;   a second plate having an outside and an inside, wherein the inside of the second plate is disposed above the inside of the first plate;   a sealant disposed on one of the inside of the first plate and the inside of the second plate;   wherein the first plate forms an air-tight coupling with the second plate about the sealant exclusively by a positive pressure gradient between the outside and the inside of at least one of the first plate and the second plate.   
     
     
         23 . The device of  claim 22 , wherein a negative pressure gradient between the outside and the inside of at least one of the first plate and the second plate exclusively removes the substantially air-tight seal. 
     
     
         24 . The device of  claim 22 , wherein the second plate is disposed above the inside of the first plate by a plurality of legs extending distally from the second plate to elevate the outside surface of the first plate. 
     
     
         25 . The device of  claim 23 , wherein the negative pressure gradient releases the first plate from the inside of the second plate. 
     
     
         26 . The device of  claim 24 , wherein the plurality of legs circumscribe the first plate. 
     
     
         27 . The device of  claim 26 , wherein  3  or more legs extend distally from the second plate. 
     
     
         28 . The device of  claim 25 , wherein the negative pressure gradient releases the first plate from the inside of the second plate whereby the first plate traverses a length of at least one leg extending distally from the inside of the second plate.