US2014091354A1PendingUtilityA1

Light emitting diode having two separated substrate parts connected together by encapsulation

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Assignee: ADVANCED OPTOELECTRONIC TECHPriority: Apr 26, 2011Filed: Dec 5, 2013Published: Apr 3, 2014
Est. expiryApr 26, 2031(~4.7 yrs left)· nominal 20-yr term from priority
Inventors:Chao-Hsiung Chang
H10W 72/0198H10H 20/0364H10H 20/857H10H 20/852H01L 33/52H01L 33/62
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Claims

Abstract

A light emitting diode includes a substrate consisting two separated parts with a gap therebetween. A first electrical connecting portion is fixed to one of the two separated parts of the substrate and adjacent to the gap. A second electrical connecting portion is fixed to the other one of the two separated parts of the substrate and adjacent to the gap. An LED chip is mounted on the substrate and electrically connected to the first and second electrical connecting portions. An encapsulation covers the LED chip and fills in at least a part of the gap to connect the two separated parts of the substrate together.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A light emitting diode comprising:
 a substrate consisting two separated parts with a gap therebetween;   a first electrical connecting portion fixed to one of the two separated parts of the substrate and adjacent to the gap;   a second electrical connecting portion fixed to the other one of the two separated parts of the substrate and adjacent to the gap;   an LED chip mounted on the substrate and electrically connected to the first and second electrical connecting portions; and   an encapsulation covering the LED chip and fill in at least a part of the gap to connect the two separated parts of the substrate together.   
     
     
         2 . The light emitting diode of  claim 1  wherein the LED chip is electrically connected to the first and second electrical connecting portions by wire bonding of metal wires. 
     
     
         3 . The light emitting diode of  claim 2 , wherein the encapsulation also covers the metal wires. 
     
     
         4 . The light emitting diode of  claim 1 , wherein the encapsulation fills the gap completely.

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