Method of manufacturing printed circuit board

Abstract

In accordance with various embodiments, there is provided a method of manufacturing a printed circuit board, the method including the steps of preparing a first carrier including a first pattern formed on one side thereof, preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof, pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates, attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other, and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.

What is claimed is: 
     
         1 . A method of manufacturing a printed circuit board, comprising:
 preparing a carrier including a first pattern formed on one side thereof;   sequentially forming a first solder resist layer and a second pattern on both sides of an adhesion layer to prepare an intermediate substrate;   disposing the carriers on both sides of the intermediate substrate such that an insulation layer faces the first pattern and then thermally pressing the carriers;   removing the carriers, forming a via for connecting the first pattern with the second pattern in the insulation layer, and then forming a second solder resist layer on the insulation layer in which the second pattern is formed; and   removing the adhesion layer.   
     
     
         2 . The method of manufacturing a printed circuit board according to  claim 1 , wherein the preparing the carrier includes:
 sequentially forming a copper foil layer and a metal barrier layer on one side or both sides of a tape;   forming a first pattern on the metal barrier layer; and   removing the tape to prepare a first carrier including the copper foil layer and the metal barrier layer whose one side is provided with the first pattern.   
     
     
         3 . The method of manufacturing a printed circuit board according to  claim 1 , wherein the preparing the intermediate substrate includes:
 forming a first solder resist layer on an adhesion layer;   forming a seed layer on the first solder resist layer; and   forming a plating layer on the seed layer and then patterning the seed layer and the plating layer to form a second pattern.   
     
     
         4 . The method of manufacturing a printed circuit board according to  claim 1 , further comprising:
 after the removing the carriers,
 forming an opening in the second solder resist layer; and 
 forming a protective layer on the first pattern exposed through the opening. 
   
     
     
         5 . The method of manufacturing a printed circuit board according to  claim 1 , further comprising:
 after the removing the adhesion layer,
 forming an opening in the first solder resist layer; and 
 forming a protective layer on the second pattern exposed through the opening. 
   
     
     
         6 . The method of manufacturing a printed circuit board according to  claim 1 , wherein the adhesion layer is made of a thermal adhesive exhibiting non-adhesiveness during heat treatment.