Package substrate and method of fabricating the same

Abstract

A package substrate and a method of fabricating the package substrate are provided. The package substrate includes a substrate having a top surface and a bottom surface opposing the top surface; an insulating protective layer formed on the top surface of the substrate; an interposer embedded in and exposed from the insulating protective layer; and passive components provided on or embedded in the interposer. By integrating the passive components into the package substrate, when a chip is provided on the interposer, the conductive path between the chip and the passive components can be shortened, and the pins of the chip have a stable voltage. Therefore, the overall electrical performance is enhanced.

What is claimed is: 
     
         1 . A package substrate, comprising:
 a substrate having a first surface and a second surface opposing to the first surface, the first surface including a plurality of conductive pads;   an insulating protective layer formed on the first surface of the substrate;   an interposer embedded in the insulating protective layer and electrically connected to the substrate, the interposer including a plurality of penetrating conductive vias and a wiring redistribution layer exposed from the insulating protective layer; and   at least a passive component provided on the first surface of the substrate.   
     
     
         2 . The package substrate of  claim 1 , wherein the at least a passive component is provided on the wiring redistribution layer and electrically connected to the interposer. 
     
     
         3 . The package substrate of  claim 1 , wherein the at least a passive component is provided on the insulating protective layer and electrically connected to the conductive pads through a plurality of conductive components formed in the insulating protective layer. 
     
     
         4 . The package substrate of  claim 3 , wherein the conductive components are made of conductive adhesive or electroplated metal. 
     
     
         5 . The package substrate of  claim 3 , wherein the conductive components are in the shape of a column. 
     
     
         6 . The package substrate of  claim 1 , wherein the insulating protective layer includes at least an opening for exposing at least one of the conductive pads, and the at least a passive component is provided on the conductive pad exposed from the opening. 
     
     
         7 . The package substrate of  claim 6 , further comprising at least another passive component embedded in the substrate. 
     
     
         8 . A method of fabricating a package substrate, comprising:
 providing a substrate having a first surface and a second surface opposing the first surface, wherein on the first surface a plurality of conductive pads and an insulating protective layer are formed, and an interposer is embedded in the insulating protective layer and electrically connected to the substrate, and includes a plurality of penetrating conductive vias and a wiring redistribution layer exposed from the insulating protective layer;   forming in the insulating protective layer at least an opening for exposing at least one of the conductive pads;   disposing a conductive component in each of the at least an opening; and   providing a passive component on the conductive component.   
     
     
         9 . The method of  claim 8 , wherein the conductive component is made of a conductive adhesive or an electroplated metal. 
     
     
         10 . The method of  claim 8 , wherein the conductive component is in the shape of a column. 
     
     
         11 . A package substrate, comprising:
 a substrate having a first surface and a second surface opposing the first surface, the first surface including a plurality of conductive pads;   an insulating protective layer formed on the first surface of the substrate;   an interposer embedded in the insulating protective layer and electrically connected to the substrate, the interposer including a plurality of penetrating conductive vias and a wiring redistribution layer exposed from the insulating protective layer; and   at least a passive component embedded in the substrate.   
     
     
         12 . The package substrate of  claim 11 , wherein the substrate includes at least a wiring through which the passive component is electrically connected to the interposer.