Semiconductor device
Abstract
According to an embodiment, a semiconductor device including a first body molded with a first resin, a second body molded with the first resin, and a third body molded with a second resin. The first body includes a first light emitting element, a primary lead, a first light receiving element, and a secondary lead. The second body includes a second light emitting element, a primary lead, a second light receiving element, and a secondary lead. The third body includes the first body and the second body. At least one common lead includes the primary leads or the secondary leads, and a portion extending between the first body and the second body, the portion being covered with a first thin film linked to the first body and a second thin film linked to the second body.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A semiconductor device comprising:
a first body molded with a first resin, the first body including:
a first light emitting element;
a plurality of first primary leads electrically connected to the first light emitting element, each first primary lead having a portion extending outward from the first body;
a first light receiving element positioned to receive light emitted by the first light emitting element; and
a plurality of first secondary leads electrically connected to the first light receiving element, each second primary lead having a portion extending outward from the first body;
a second body molded with the first resin, the second body including:
a second light emitting element;
a plurality of second primary leads electrically connected to the second light emitting element, each second primary lead having a portion extending outward from the second body;
a second light receiving element positioned to receive light emitted by the second light emitting element; and
a plurality of second secondary leads electrically connected to the second light receiving element, each second secondary lead having a portion extending outward from the second body; and
a third body molded with a second resin, the third body including the first body and the second body, one of the first primary leads and the first secondary leads having the portion extending outward from the first body into the second body, and connected to any one of the second primary leads and the second secondary leads, the portion connecting the one of the first primary leads and the first secondary leads to the any one of the second primary leads and the second secondary leads being covered with a film linked to the first body and the second body.
2 . The device according to claim 1 , wherein
one of the second primary leads and the second secondary leads has the portion extending outward from the second body into the first body, and connected to any one of the first primary leads and the first secondary leads; and the portion connecting the one of the second primary leads and the second secondary leads to the any one of the first primary leads and the first secondary leads is covered with the film.
3 . The device according to claim 1 , wherein
a light emitting surface of the first light emitting element faces a light receiving surface of the first light receiving element, and a light emitting surface of the second light emitting element faces a light receiving surface of the second light receiving element.
4 . The device according to claim 1 , wherein the third body covers the film.
5 . The device according to claim 1 , wherein the third body includes a light blocking portion provided between the first body and the second body.
6 . The device according to claim 1 , wherein the first resin and the second resin comprise a main ingredient that is the same, and the second resin further comprises an additive that is not included in the first resin.
7 . The device according to claim 1 , wherein a main ingredient of the first resin and a main ingredient of the second resin are each epoxy resin.
8 . The device according to claim 1 , wherein
the first resin transmits light emitted by the first light emitting element and light emitted by the second light emitting element, and the second resin blocks external light, light emitted from the first light emitting element and light emitted from the second light emitting element.
9 . The device according to claim 7 , wherein the second resin includes a light absorbing material.
10 . The device according to claim 7 , wherein the second resin includes a light reflecting material.
11 . The device according to claim 1 , wherein
one of the first secondary leads has a first mount portion and a portion that is extending outward from the first body into the second body and connected to a second secondary lead having a second mounting portion; and the first light receiving element is mounted on the first mount portion, and the second light receiving element is mounted on the second mount portion.
12 . The device according to claim 11 , wherein
one of the second secondary leads has a portion extending outward from the second body into the first body, and connecting to another one of the first secondary leads; and the one of the second secondary leads is electrically connected to the first light receiving element and the second light receiving element, and supplies electrical power thereto.
13 . The device according to claim 1 , wherein
the first secondary leads includes another one outputting a signal detected by the first receiving element, and the second secondary leads includes the other one outputting a signal detected by the second light receiving element.
14 . The device according to claim 1 , wherein the film is molded with the first resin.
15 . The device according to claim 1 , wherein the film is made of epoxy resin.
16 . The device according to claim 1 , further comprising:
a through gate portion provided between the first and second bodies, the through gate portion being made of the first resin, and joining the first and second bodies.Join the waitlist — get patent alerts
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