Serial plating system

Abstract

A serial plating system includes a plurality of nozzles that are disposed in a plating tank at a position opposite to a plurality of workpieces, and that discharge a plating solution toward the plurality of workpieces, and a plurality of anodes that are disposed in the plating tank at a position opposite to the plurality of workpieces that are serially transferred in the plating tank, one nozzle among the plurality of nozzles and at least one anode among the plurality of anodes being alternately and repeatedly disposed along a transfer direction in which the plurality of workpieces are serially transferred. The plurality of nozzles and the plurality of anodes may be disposed to overlap in a side view along the transfer direction.

What is claimed is: 
     
         1 . A serial plating system comprising:
 a plating tank that holds a plating solution, and plates a plurality of workpieces that are serially transferred while being held by a transfer jig, and are set to as a cathode;   a plurality of nozzles that are disposed in the plating tank at a position opposite to the plurality of workpieces, and that discharge the plating solution toward the plurality of workpieces; and   a plurality of anodes that are disposed in the plating tank at a position opposite to the plurality of workpieces that are serially transferred in the plating tank, and   one nozzle among the plurality of nozzles and at least one anode among the plurality of anodes being alternately and repeatedly disposed along a transfer direction in which the plurality of workpieces are serially transferred.   
     
     
         2 . The serial plating system as defined in  claim 1 ,
 the plurality of nozzles and the plurality of anodes being disposed to overlap in a side view along the transfer direction.   
     
     
         3 . The serial plating system as defined in  claim 1 ,
 each of the plurality of anodes having a horizontal cross-sectional profile so that a distance from a plating target surface of each of the plurality of workpieces increases as a distance from an electrode centerline that divides each of the plurality of anodes into two parts in a plan view and perpendicularly intersects the transfer direction increases.   
     
     
         4 . The serial plating system as defined in  claim 3 ,
 each of the plurality of anodes having a curved horizontal cross-sectional profile.   
     
     
         5 . The serial plating system as defined in  claim 3 ,
 each of the plurality of anodes having a circular horizontal cross-sectional profile.   
     
     
         6 . The serial plating system as defined in  claim 1 ,
 each of the plurality of anodes being an insoluble anode.   
     
     
         7 . The serial plating system as defined in  claim 1 ,
 each of the plurality of nozzles having a circular horizontal cross-sectional profile having a diameter that is smaller than a diameter of a horizontal cross section of each of the plurality of anodes.   
     
     
         8 . The serial plating system as defined in  claim 1 ,
 a center of a horizontal cross section of each of the plurality of nozzles being disposed at a position closer to the plating target surface of each of the plurality of workpieces as compared with a center of a horizontal cross section of each of the plurality of anodes.   
     
     
         9 . The serial plating system as defined in  claim 8 ,
 a first minimum distance δ1 from each of the plurality of nozzles to the plating target surface of each of the plurality of workpieces being less than a second minimum distance δ2 from each of the plurality of anodes to the plating target surface of each of the plurality of workpieces, and   an outer diameter of each of the plurality of nozzles being less than the second minimum distance δ2.   
     
     
         10 . The serial plating system as defined in  claim 9 ,
 a third minimum distance δ3 between each of the plurality of anodes and each of the plurality of nozzles being less than the second minimum distance δ2.   
     
     
         11 . The serial plating system as defined in  claim 10 ,
 the third minimum distance δ3 being equal to or greater than the first minimum distance δ1.