Edge-grinding machine for liquid crystal panel

Abstract

The present disclosure provides an edge-grinding machine used for grinding a liquid crystal panel. The edge-grinding machine includes a chamfering grinding wheel assembly corresponding to a cutting edge of the liquid crystal panel for chamfering the cutting edge and further removing a sharp portion of the cutting edge; and a reshaping grinding wheel assembly corresponding to a complete cutting surface of the liquid crystal panel for reshaping the complete cutting surface and further removing a step and unwanted objects on the complete cutting surface. The edge-grinding machine of the present disclosure is capable of chamfering the corresponding cutting edge of the liquid crystal panel while reshaping the complete cutting surface for removing the step and unwanted objects thereon, which saves resources and labors required to reshape the liquid crystal panel and thus improves the yield rate of the liquid crystal panel.

What is claimed is: 
     
         1 . An edge-grinding machine used for grinding a liquid crystal panel, comprising:
 a chamfering grinding wheel assembly corresponding to a cutting edge of the liquid crystal panel for chamfering the cutting edge and further removing a sharp portion of the cutting edge; and   a reshaping grinding wheel assembly corresponding to a complete cutting surface of the liquid crystal panel for reshaping the complete cutting surface and further removing a step and unwanted objects on the complete cutting surface.   
     
     
         2 . The edge-grinding machine as claimed in  claim 1 , wherein the cutting edge comprises a first cutting edge formed on a TFT substrate of the liquid crystal panel and a second cutting edge formed on a CF substrate of the liquid crystal panel; the chamfering grinding wheel assembly comprises a first grinding wheel group having a first grinding wheel and a second grinding wheel respectively corresponding to the first cutting edge and the second cutting edge. 
     
     
         3 . The edge-grinding machine as claimed in  claim 2 , wherein the first grinding wheel is spaced away from the second grinding wheel along a moving direction of the liquid crystal panel. 
     
     
         4 . The edge-grinding machine as claimed in  claim 3 , wherein the chamfering grinding wheel assembly further comprises at least one second grinding wheel group used for re-grinding the cutting edge chamfered by the first grinding wheel group;
 each second grinding wheel group comprises a third grinding wheel and a fourth grinding wheel, the third grinding wheel corresponds to the first cutting edge and is spaced away from the first grinding wheel, and the fourth grinding wheel corresponds to the second cutting edge and is spaced away from the second grinding wheel.   
     
     
         5 . The edge-grinding machine as claimed in  claim 4 , wherein a rotating direction of the first grinding wheel is the same as that of the second grinding wheel, and the rotating direction of the second grinding wheel is the same as that of the fourth grinding wheel but opposite to that of the first grinding wheel/the third grinding wheel. 
     
     
         6 . The edge-grinding machine as claimed in  claim 1 , wherein the complete cutting surface comprises a first cutting surface formed on the TFT substrate and a second cutting surface formed on the CF substrate, the reshaping grinding wheel assembly comprises a first reshaping grinding wheel corresponding to the first cutting surface and the second cutting surface for removing the step formed between the first cutting surface and the second cutting surface and further keeping the first cutting surface coplanar with the second cutting surface. 
     
     
         7 . The edge-grinding machine as claimed in  claim 6 , wherein the reshaping grinding wheel assembly further comprises at least one second reshaping grinding wheel for re-grinding the first cutting surface and the second cutting surface reshaped by the first reshaping grinding wheel, and each second grinding wheel is parallel to and spaced away from the first reshaping grinding wheel. 
     
     
         8 . The edge-grinding machine as claimed in  claim 7 , wherein a layer of grinding material is disposed on an outer surface of the first reshaping grinding wheel or the at least one second reshaping grinding wheel. 
     
     
         9 . The edge-grinding machine as claimed in  claim 7 , wherein a diameter of the at least one second reshaping grinding wheel is larger than that of the first reshaping grinding wheel. 
     
     
         10 . The edge-grinding machine as claimed in  claim 6  further comprising a controlling assembly, the controlling assembly is connected to the chamfering grinding wheel assembly and the reshaping grinding wheel assembly for controlling the chamfering grinding wheel assembly and the reshaping grinding wheel assembly to move to correspond to the cutting edge and the complete cutting surface needed to be reshaped. 
     
     
         11 . An edge-grinding machine for processing a liquid crystal panel having at least one cutting edge and at least one complete cutting surface, comprising:
 a first chamfering grinding wheel group corresponding to the cutting edge for chamfering the cutting edge; and   a first reshaping grinding wheel corresponding to the complete cutting surface for reshaping the complete cutting surface and further for removing a step and unwanted objects on the complete cutting surface.   
     
     
         12 . The edge-grinding machine as claimed in  claim 11 , wherein the cutting edge comprises a first cutting edge formed on a TFT substrate of the liquid crystal panel and a second cutting edge formed on a CF substrate of the liquid crystal panel, the first grinding wheel group comprises a first grinding wheel and a second grinding wheel respectively corresponding to the first cutting edge and the second cutting edge for chamfering the first cutting edge and the second cutting edge. 
     
     
         13 . The edge-grinding machine as claimed in  claim 12 , wherein the first grinding wheel is spaced away from the second grinding wheel along a moving direction of the liquid crystal panel. 
     
     
         14 . The edge-grinding machine as claimed in  claim 13 , wherein the rotating direction of the first grinding wheel is opposite to that of the second grinding wheel. 
     
     
         15 . The edge-grinding machine as claimed in  claim 12  further comprising at least one second grinding wheel group parallel to the first grinding wheel group, each second grinding wheel group is spaced away from the first grinding wheel group along the moving direction of the liquid crystal panel for re-grinding the corresponding cutting edge chamfered by the first grinding wheel group. 
     
     
         16 . The edge-grinding machine as claimed in  claim 11 , wherein the complete cutting surface comprises a first cutting surface formed on a TFT substrate of the liquid crystal panel and a second cutting surface formed on a CF substrate of the liquid crystal panel, and the first reshaping grinding wheel reshapes the first cutting surface and the second cutting surface to keep the first cutting surface coplanar with the second cutting surface. 
     
     
         17 . The edge-grinding machine as claimed in  claim 16 , wherein a layer of grinding material is covered on an outer surface of the first reshaping grinding wheel. 
     
     
         18 . The edge-grinding as claimed in  claim 16  further comprising at least one second reshaping grinding wheel parallel to the first grinding wheel, the second reshaping grinding wheel is spaced away from the first grinding wheel for re-grinding the first cutting surface and the second cutting surface reshaped by the first grinding wheel. 
     
     
         19 . The edge-grinding machine as claimed in  claim 18 , wherein a diameter of the second grinding wheel is greater than that of the first grinding wheel. 
     
     
         20 . The edge-grinding machine as claimed in  claim 16  further comprising a controlling assembly connected to the first grinding wheel group and the first reshaping grinding wheel for controlling the first grinding wheel group and the first reshaping grinding wheel to move to the corresponding cutting edge and the complete cutting surface needed to be reshaped.