Connecting component equipped with hollow inserts

Abstract

Electro-mechanical connection component provided on one connection surface with conductive inserts intended to be inserted at ambient temperature into respective ductile conductive pads formed on a surface of another connection component for a face-to-face type hybridization. Each insert of the component includes: a hollow metal core formed of a bottom arranged on the connection surface and of a lateral wall protruding from said bottom, defining an internal surface of the insert, at least a portion of said internal surface being non-oxidized; and a metal layer substantially only covering the internal surface of the metal core.

1 . A method of manufacturing an electro-mechanical connection component provided on one connection surface with conductive inserts intended to be inserted at ambient temperature into respective ductile conductive pads formed on a surface of another connection component for a face-to-face type hybridization,
 wherein the method comprises, for each insert:
 forming a hollow metal core formed of a bottom arranged on the connection surface and of a lateral wall protruding from said bottom, defining an internal surface of the insert, at least a portion of said internal surface being non-oxidized; and 
 forming a metal layer substantially only covering the internal surface of the metal core and intended to be in contact with the pad associated with the insert; 
   and wherein the metal layer is made of an inoxidizable metal, especially a noble metal, or wherein the forming of the metal layer comprises:
 forming a first metal sub-layer non-oxidized over at least a portion of its surface, covering at least said non-oxidized portion of the internal surface of the core, the first sub-layer having a greater plasticity than the core; and 
 fouling a second sub-layer covering at least the first sub-layer over its non-oxidized portion and having a lower plasticity than the first sub-layer. 
   
     
     
         2 . The method of  claim 1 , wherein the first sub-layer is made of an oxidizable metal and wherein the second sub-layer is made by oxidizing the first sub-layer to create a layer of native oxide of the metal forming the first sub-layer having a plasticity lower than that of the first sub-layer. 
     
     
         3 . The method of  claim 2 , wherein the first sub-layer is made of aluminum, the second sub-layer being an aluminum oxide. 
     
     
         4 . The method of  claim 1 , wherein the hollow metal core is made of a hard metal, particularly of titanium nitride, of tungsten nitride, of copper, of vanadium, of molybdenum, of nickel, of titanium tungstenate, of WSi, and/or of tungsten. 
     
     
         5 . The method of  claim 1 , wherein the adherence of the second sub-layer to the first sub-layer is low so that the second sub-layer slides on the first sub-layer under the effect of a shearing applied to the stack of the first and second sub-layers. 
     
     
         6 . The method of  claim 1 , wherein the first sub-layer has a ductility substantially equal to that of the pads. 
     
     
         7 . A method of face-to-face type hybridization of a microelectronic component obtained according to the method of any of the foregoing claims with a micro-electronic component having on one of its surfaces respective ductile conductive pads having a lower hardness than the metal core of the hollow inserts, comprising the insertion at ambient temperature of the inserts, provided with their second metal sub-layer, into the pads. 
     
     
         8 . The method of  claim 7 , wherein the interconnect pitch between microcomponents is smaller than 10 micrometers.