Optical module with enhanced robustness of temperature controlling device

Abstract

An optical assembly (OSA) that installs a semiconductor optical device mounted on a thermo-electric controller (TEC) is disclosed. The TEC in the upper plate thereof is mechanically connected to the housing, or to the block stiffly fixed to the housing by a bridge made of stiff material. The bridge preferably extends along the optical axis to show enhanced durability against the impact caused by an external ferrule abutting against the receptacle of the OSA.

1 . An optical sub-assembly, comprising:
 a housing with a side wall and another side wall facing said side wall, said another side wall providing an insulating member;   a thermo-electric controller (TEC) installed in said housing, said TEC mounting a semiconductor optical device thereon;   a receptacle provided in said side wall of said housing, said receptacle receiving an external optical connector with a ferrule, wherein said ferrule abutting against a deep end of said receptacle to cause an impact to said TEC; and   a bridge mechanically connecting a top portion of said TEC to said insulating member in said another side wall of said housing, said bridge being made of ceramics,   wherein said bridge extends along an optical axis of said optical sub-assembly.   
     
     
         2 . The optical sub-assembly of  claim 1 ,
 wherein said TEC comprises a top plate, a bottom plate and a plurality of thermo-controlling elements,   wherein said top portion is one of said top plate of said TEC and a top surface of a member mounted on said top plate of said TEC.   
     
     
         3 . The optical sub-assembly of  claim 2 ,
 wherein said member is a carrier mounted on said top plate of said TEC.   
     
     
         4 .- 8 . (canceled) 
     
     
         9 . The optical sub-assembly of  claim 1 ,
 wherein said ceramics is one of aluminum oxide (Al 2 O 3 ) and aluminum nitride (AlN).   
     
     
         10 . The optical sub-assembly of  claim 1 ,
 wherein said bridge provides one of a micro-strip line, a co-planar line, and a grounded micro-strip line.   
     
     
         11 . The optical sub-assembly of  claim 1 ,
 wherein said bridge has a thickness of at least 0.1 mm.   
     
     
         12 . The optical sub-assembly of  claim 1 ,
 wherein said bridge has a width of at least 0.15 mm.   
     
     
         13 . The optical sub-assembly of  claim 1 ,
 wherein said bridge is arranged in an opposite side to said receptacle with respect to said TEC.