Cooling apparatus having a cooling conduit
Abstract
A cooling apparatus is disclosed. The cooling apparatus includes a carrier and a flat-plate type cooling conduit. The flat-plate type cooling conduit is made of a high thermal conductive material and disposed on or in the carrier. The flat-plate type cooling conduit includes a conduit portion and a flat plate portion. The conduit portion has a conducting hole for conducting a coolant, and the flat plate portion is adhered to the carrier for allowing the coolant to perform heat exchange through a large contact area between the flat plate portion and the carrier. In addition, a cooling source gel can be used to perform heat exchange with the coolant in the conducting hole in order to improve the heat exchange efficiency of the cooling apparatus, and to effectively reduce the temperature of the carrier.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A cooling apparatus comprising:
a carrier; and a flat-plate type cooling conduit made of a high thermal conductive material, disposed on or in the carrier, and comprising:
a conduit portion having a conducting hole for conducting a coolant; and
a flat plate portion adhered to the carrier for allowing the coolant to perform heat exchange through a contact area between the flat plate portion and the carrier.
2 . The cooling apparatus of claim 1 , wherein the carrier is clothing, bedding, mattresses, chair cushions, cushions, or back cushions.
3 . The cooling apparatus of claim 1 , wherein the flat-plate type cooling conduit is made of a combination of a flexible material and the high thermal conductive material.
4 . The cooling apparatus of claim 3 , in the flexible material is silicone, latex, rubber, silicone, fiberglass, nylon, Teflon, polyurethane (PU), polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), perfluoroalkoxy fluorocarbon (PFA), perfluorinated ethylene-propylene (FEP), or acrylonitrile-butadience styrene plastics (ABS).
5 . The cooling apparatus of claim 1 , wherein the high thermal conductive material is Al, Au, Ag, Cu, AlN, Al2O3, SiC, BeO, diamond powder, carbon material, graphite, silicon, silica, BN or a mixture thereof, or Al, Au, Ag, Cu, AlN, Al2O3, SiC, BeO, diamond powder, carbon material, graphite, silicon, silica, BN or a mixture thereof after nanolization.
6 . The cooling apparatus of claim 1 , wherein the conduit portion has a circular or oval-shaped cross-section, and the flat plate portion has a rectangular cross-section.
7 . The cooling apparatus of claim 1 , wherein the coolant includes water, ice or a mixture thereof.
8 . The cooling apparatus of claim 1 , further comprising a cooling source gel for performing heat exchange with the coolant in the conducting hole.
9 . The cooling apparatus of claim 8 , further comprising a container for receiving the cooling source gel, wherein the conduit portion passes through the container.
10 . The cooling apparatus of claim 1 , further comprising a control unit connected to the conduit portion for turning on or off a circulating flow of the coolant inside the conduit portion, or for adjusting a direction of circulation of the coolant inside the conduit portion.Join the waitlist — get patent alerts
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