Package interface plate for package isolation structures

Abstract

A package assembly comprises a package base, a sensor die, an isolation plate, and a package interface plate. The isolation plate is bonded to the sensor die and has a plurality of flexible beams. Each flexible beam is configured to deflect under stress such that effects on the sensor die of a thermal mismatch between the package base and the sensor die are reduced. The package interface plate is bonded to the isolation plate and the package base. The package interface plate is configured to limit the maximum distance each flexible beam is able to deflect.

What is claimed is: 
     
         1 . A method of manufacturing a package assembly, the method comprising:
 bonding at least one pedestal on a first surface of a package interface plate to a first surface of a respective one of a plurality of paddles in an isolation plate such that a gap is formed between the first surface of the package interface plate and the isolation plate based on a predetermined height of the at least one pedestal;   bonding a second surface of at least one of the plurality of paddles in the isolation plate to a sensor die; and   bonding a second surface of the package interface plate to a package base.   
     
     
         2 . The method of  claim 1 , wherein bonding the at least one pedestal to the first surface of the respective one of the plurality of paddles comprises anodically bonding the at least one pedestal to the first surface of the respective one of the plurality of paddles. 
     
     
         3 . The method of  claim 1 , wherein bonding the at least one pedestal to the first surface of the respective one of the plurality of paddles comprises bonding the at least one pedestal to the first surface of the respective one of the plurality of paddles at a wafer level. 
     
     
         4 . The method of  claim 1 , wherein bonding the second surface of at least one of the plurality of paddles in the isolation plate to the sensor die comprises bonding the second surface of at least one of the plurality of paddles in the isolation plate to the sensor die at a wafer level. 
     
     
         5 . The method of  claim 1 , wherein the predetermined height of the at least one pedestal is approximately 4 microns. 
     
     
         6 . The method of  claim 1 , wherein bonding the second surface of at least one of the plurality of paddles in the isolation plate to the sensor die comprises bonding the second surface of at least one of the plurality of paddles in the isolation plate to the sensor die using one of solder, epoxy, or gold bumps. 
     
     
         7 . The method of  claim 1 , wherein bonding the second surface of the package interface plate to the package base comprises bonding the second surface of the package interface plate to the package base using an array of one of solder, epoxy, or gold bumps.