Organic light emitting device and manufacturing method thereof

Abstract

A method for manufacturing an organic light emitting device includes: forming an organic light emitting display panel including a substrate provided on a support substrate, an organic light emitting element on the substrate, and a thin film encapsulating film covering the organic light emitting element; detaching the support substrate from the organic light emitting display panel; attaching a bottom protecting film to a bottom of the organic light emitting display panel, the bottom protecting film comprising a first electricity removing layer configured to remove static electricity; and cutting the organic light emitting display panel into a plurality of organic light emitting devices.

What is claimed is: 
     
         1 . An organic light emitting device comprising:
 a substrate;   an organic light emitting element on the substrate;   a thin film encapsulating film covering the organic light emitting element; and   a bottom protecting film attached to a bottom of the substrate, the bottom protecting film comprising a first electricity removing layer configured to remove static electricity.   
     
     
         2 . The organic light emitting device of  claim 1 , wherein
 the organic light emitting element comprises:   a gate line on the substrate and configured to transmit a scan signal;   a data line and a driving voltage line crossing the gate line in an insulated manner and configured to transmit a data signal and a driving voltage, respectively;   a switching thin film transistor connected to the gate line and the data line;   a drive thin film transistor connected to the switching thin film transistor and the driving voltage line;   a pixel electrode connected to the driving transistor;   an organic light emitting member on the pixel electrode; and   a common electrode on the organic light emitting member.   
     
     
         3 . The organic light emitting device of  claim 1 , wherein the substrate is a flexible substrate. 
     
     
         4 . The organic light emitting device of  claim 1 , wherein the bottom protecting film further comprises a carrier film and an adhesive layer on the carrier film, and
 wherein the first electricity removing layer is between the substrate and the adhesive layer and contacts the substrate.   
     
     
         5 . The organic light emitting device of  claim 1 , wherein the bottom protecting film further comprises a carrier film and an adhesive layer on the carrier film and contacting the substrate, and
 wherein the carrier film and the adhesive layer are between the substrate and the first electricity removing layer.   
     
     
         6 . The organic light emitting device of  claim 1 , wherein the bottom protecting film further comprises a second electricity removing layer, a carrier film provided on the second electricity removing layer, and an adhesive layer on the carrier film, and
 wherein the first electricity removing layer is between the substrate and the adhesive layer.   
     
     
         7 . The organic light emitting device of  claim 1 , wherein the carrier film comprises one of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethylene sulfide (PES), and polyethylene (PE). 
     
     
         8 . The organic light emitting device of  claim 1 , wherein the carrier film is 25 μm to 300 μm thick. 
     
     
         9 . The organic light emitting device of  claim 1 , wherein the adhesive layer is an acryl-based strong adhesive film. 
     
     
         10 . The organic light emitting device of  claim 9 , wherein adhesiveness of the adhesive layer is greater than 500 gf/inch when a substance to be adhered is stainless steel (SUS). 
     
     
         11 . The organic light emitting device of  claim 1 , further comprising at least one of a light blocking layer and heat dissipating plate between the carrier film and the adhesive layer. 
     
     
         12 . A method for manufacturing an organic light emitting device, comprising:
 forming an organic light emitting display panel comprising a substrate provided on a support substrate, an organic light emitting element on the substrate, and a thin film encapsulating film covering the organic light emitting element;   detaching the support substrate from the organic light emitting display panel;   attaching a bottom protecting film to a bottom of the organic light emitting display panel, the bottom protecting film comprising a first electricity removing layer configured to remove static electricity; and   cutting the organic light emitting display panel into a plurality of organic light emitting devices.   
     
     
         13 . The method of  claim 12 , wherein the substrate is a flexible substrate. 
     
     
         14 . The method of  claim 12 , wherein the bottom protecting film further comprises a carrier film, an adhesive layer on the carrier film, and a first electricity removing layer on the adhesive layer, and
 wherein the attaching the bottom protecting film comprises:
 providing the bottom protecting film with a release film attached to the first electricity removing layer; and 
 removing the release film from the bottom protecting film. 
   
     
     
         15 . The method of  claim 12 , wherein the bottom protecting film further comprises a first electricity removing layer, a carrier film on the first electricity removing layer, and an adhesive layer on the carrier film, and
 wherein the attaching of the bottom protecting film comprises:
 providing the bottom protecting film with a release film attached to the adhesive layer; and 
   removing the release film from the bottom protecting film.   
     
     
         16 . The method of  claim 12 , wherein
 the bottom protecting film further comprises a second electricity removing layer, a carrier film provided on the second electricity removing layer, an adhesive layer on the carrier film, and a first electricity removing layer on the adhesive layer, and   wherein the attaching of a bottom protecting film comprises:
 providing the bottom protecting film with a release film attached to the first electricity removing layer; and 
 detaching the release film from the bottom protecting film. 
   
     
     
         17 . The method of  claim 12 , wherein the adhesive layer is an acryl-based strong adhesive film. 
     
     
         18 . The method of  claim 17 , wherein adhesiveness of the adhesive layer is greater than 500 gf/inch when a substance to be adhered is a stainless steel (SUS). 
     
     
         19 . The method of  claim 12 , further comprising forming a light blocking layer or a heat dissipating plate between the carrier film and the adhesive layer. 
     
     
         20 . The method of  claim 12 , further comprising attaching a top protecting film on a thin film encapsulating film of the organic light emitting display panel before detaching the support substrate from the organic light emitting display panel. 
     
     
         21 . The method of  claim 20 , further comprising cutting the organic light emitting display panel to separate it into a plurality of organic light emitting devices and removing the top protecting film.