Optical-semiconductor device

Abstract

The present invention relates to an optical-semiconductor device, which is prepared by: arranging a sheet for optical-semiconductor element encapsulation including an encapsulating resin layer capable of embedding an optical-semiconductor element and a wavelength conversion layer containing light wavelength-converting particles and being laminated directly or indirectly on the encapsulating resin layer, on an optical-semiconductor element-mounting substrate so that the encapsulating resin layer faces the optical-semiconductor element-mounting substrate; followed by compression-molding, in which the wavelength conversion layer is present on an upper part of a molded body in which the optical-semiconductor element is embedded therein, but is not present on a side surface of the molded body.

What is claimed is: 
     
         1 . A method for producing the optical-semiconductor device, said method comprising:
 arranging a sheet for optical-semiconductor element encapsulation comprising an encapsulating resin layer capable of embedding an optical-semiconductor element and a wavelength conversion layer containing light wavelength-converting particles and being laminated directly or indirectly on said encapsulating resin layer, on an optical-semiconductor element-mounting substrate so that said encapsulating resin layer faces said substrate; and   applying a pressure on a surface of the sheet for optical-semiconductor element encapsulation by using a flat face, thereby molding,   wherein said wavelength conversion layer is present on an upper part of a molded body in which the optical-semiconductor element is embedded therein, but is not present on a side surface of said molded body.   
     
     
         2 . A method for producing the optical-semiconductor device, said method comprising:
 arranging a sheet for optical-semiconductor element encapsulation comprising an encapsulating resin layer capable of embedding an optical-semiconductor element and a wavelength conversion layer containing light wavelength-converting particles and being laminated directly or indirectly on said encapsulating resin layer, on an optical-semiconductor element-mounting substrate so that said encapsulating resin layer faces said substrate; and   applying a pressure on a surface of the sheet for optical-semiconductor element encapsulation by using a flat face, thereby molding,   wherein the following formulae (I) and (II) are satisfied when a thickness of the encapsulating resin layer is regarded as (X) (mm), an area of the sheet for optical-semiconductor element encapsulation necessary for encapsulating one optical-semiconductor element is regarded as (Y) (mm 2 ) and an area of an upper part of the optical-semiconductor element is regarded as (A) (mm 2 ):
   0.5≦ X≦ 2.0  (I)
 
   { X ×tan(75°)} 2   ×π+A≦Y≦{X ×tan(80°)} 2   ×π+A   (II)