Device module and method of manufacturing the same

Abstract

The invention provides a device module that can be manufactured with a die. The device module includes a plastic part, a device, a holder, and an external connection. The device is embedded in the plastic part. The holder is embedded in the plastic part and includes an exposed portion exposed from the plastic part in a thickness direction of the plastic part in such a manner as to close a housing recess of the die. The external connection is connected to the device and partially fixed to the holder. The external connection includes a lead-out portion insertable in the housing recess of the die. The lead-out portion is embedded in the plastic part and being led out of the plastic part in the thickness direction. Alternatively, the lead-out portion is led through and out of the holder in the thickness direction.

1 . A device module manufacturable with a die, the device module comprising:
 a plastic part;   a device being a sensor, an electronic component, or a circuit board, the device being embedded in the plastic part;   a holder embedded in the plastic part, the holder including an exposed portion exposed from the plastic part in a thickness direction of the plastic part in such a manner as to close a housing recess of the die; and   an external connection connected to the device and partially fixed to the holder, the external connection including:
 a lead-out portion insertable in the housing recess of the die, the lead-out portion being embedded in the plastic part and being led out of the plastic part in the thickness direction, or alternatively the lead-out portion being led through and out of the holder in the thickness direction. 
   
     
     
         2 . The device module according to  claim 1 , wherein
 the holder includes:
 a base embedded in the plastic part, and 
 the exposed portion protruding from the plastic part in the thickness direction 
 in such a manner as to fit in the housing recess of the die. 
   
     
     
         3 . The device module according to  claim 2 , wherein
 the exposed portion of the holder is tapered.   
     
     
         4 . The device module according to  claim 1 , wherein
 the die includes a fitting projection provided on an edge of the housing recess, and   the exposed portion includes a fitting recess to fit over the fitting projection.   
     
     
         5 . The device module according to  claim 1 , the device module further comprising:
 a sheet having a first face provided with the plastic part, wherein   the external connection includes an embedded portion embedded in the plastic part, and   at least a part of the embedded portion is disposed on the first face of the sheet, and the holder is disposed on the at least the part of the embedded portion.   
     
     
         6 . The device module according to  claim 5 , wherein
 a gap is left between the holder and the sheet, and   the gap is filled with plastic material of the plastic part.   
     
     
         7 . The device module according to  claim 1 , wherein
 the holder has a through hole passing through the holder in the thickness direction to receive therethrough the lead-out portion of the external connection.   
     
     
         8 . The device module according to  claim 1 , wherein
 the external connection is partially fixed to an outer face of the holder, and   the external connection and the holder in combination close the housing recess of the die.   
     
     
         9 . The device module according to  claim 1 , wherein
 the lead-out portion of the external connection is partially embedded in the holder.   
     
     
         10 . The device module according to  claim 1 , wherein
 the holder comprises a plurality of pieces surrounding a part of the lead-out portion of the external connection.   
     
     
         11 . The device module according to  claim 1 , wherein
 the holder is made of plastic material that is the same as or in a same group as that of the plastic part.   
     
     
         12 . A method of manufacturing a device module, the method comprising:
 partially fixing an external connection to a holder, a first end of the external connection being connected to a device, the device being a sensor, an electronic component, or a circuit board;   placing the device, a first end portion of the external connection, and the holder into a cavity of first and second dies, inserting a second end portion of the external connection into a housing recess of the first die, and closing the housing recess of the first die with the holder; and   in this state, injecting plastic material into the cavity to insert-mold the device, the first end portion of the external connection, and the holder in the plastic material.   
     
     
         13 . The method according to  claim 12 , wherein
 the closing of the housing recess includes fitting a distal portion of the holder in the housing recess of the first die.   
     
     
         14 . The method according to  claim 13 , wherein
 the distal portion of the holder is tapered.   
     
     
         15 . The method according to  claim 13 , wherein
 at least a part of an edge of the housing recess of the first die forms a tapered portion.   
     
     
         16 . The method according to  claim 12 , wherein
 the closing of the housing recess includes fitting a fitting projection into a fitting recess of the holder, the fitting projection being provided on an edge of the housing recess of the first die.   
     
     
         17 . The method according to  claim 12 , wherein
 the placing of the device, the first end portion of the external connection, and the holder into the cavity includes placing a sheet in the cavity, disposing at least a part of the external connection on the sheet, disposing the holder on the at least the part of the external connection, and bringing the holder into contact with the first die to close the housing recess of the first die, and   the injecting of the plastic material includes injecting the plastic material on the sheet to insert-mold the device, the first end portion of the external connection, and the holder on the sheet with the plastic material.   
     
     
         18 . The method according to  claim 12 , wherein
 the placing of the device, the first end portion of the external connection, and the holder includes bringing the holder into contact with the first die and the second die to close the housing recess of the first die.   
     
     
         19 . The method according to  claim 12 , wherein
 the closing of the housing recess of the first die including fixing the holder to the first die.   
     
     
         20 . The method according to  claim 17 , wherein
 a gap is left between the holder and the sheet in the cavity, and   the injecting of the plastic material into the cavity includes flowing the plastic material into the gap.   
     
     
         21 . The method according to  claim 12 , wherein
 the holder has a through hole passing through the holder in the thickness direction, and   the fixing of the external connection to the holder includes inserting the external connection into the through hole of the holder.   
     
     
         22 . The method according to  claim 12 , wherein
 the fixing of the external connection to the holder includes fixing a part of the external connection to an outer face of the holder, and   the closing of the housing recess of the first die includes closing the housing recess with the part of the external connection and the holder.   
     
     
         23 . The method according to  claim 12 , wherein
 the fixing of the external connection to the holder includes insert-molding a part of the external connection in the holder.   
     
     
         24 . The method according to  claim 12 , wherein
 the holder includes a plurality of pieces configured to surround a part of the external connection,   the fixing of the external connection to the holder includes combining the plurality of pieces to surround the part of the external connection.   
     
     
         25 . The method according to  claim 12 , wherein
 the holder is made of plastic material that is the same as or in a same group as that of the plastic part.