US2014035094A1PendingUtilityA1
Semiconductor structure
Est. expirySep 23, 2030(~4.2 yrs left)· nominal 20-yr term from priority
Inventors:Eric Graetz
H10W 10/181H10P 90/1922H10D 62/10H01L 29/06
46
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Claims
Abstract
One or more embodiments relate to a semiconductor structure, comprising: a silicon rubber layer; and a semiconductor layer overlying the silicon rubber layer.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A semiconductor structure, comprising:
a silicone rubber layer; and a semiconductor layer overlying said silicone layer.
2 . The structure of claim 1 , wherein said semiconductor layer comprises monocrystalline silicon.
3 . The structure of claim 1 , further comprising a device, at least a portion of said device disposed within said semiconductor layer and/or at least a portion of said device disposed over said semiconductor layer.
4 . The structure of claim 3 , wherein said device is a lateral device.
5 . The structure of claim 1 , wherein said semiconductor layer is in direct contact with said silicone rubber layer.
6 . A semiconductor structure, comprising:
a dielectric layer having a thickness of at least about 25 microns; and a semiconductor layer overlying said dielectric layer.
7 . The structure of claim 8 , wherein said semiconductor layer comprises bulk moncrystalline silicon.
8 . The structure of claim 8 , further comprising a device, at least a portion of said device disposed within said semiconductor layer and/or at least a portion of said device disposed over a front side of said semiconductor layer.
9 . The structure of claim 8 , wherein said device is a lateral device.
10 . The structure of claim 6 , wherein said dielectric layer has a thickness of at least about 50 microns.
11 . The structure of claim 6 , wherein said dielectric layer is a solid material.
12 . The structure of claim 6 , wherein said semiconductor layer is in direct contact with said dielectric layer.
13 . The structure of claim 6 , wherein dielectric layer comprises silicon rubber.Join the waitlist — get patent alerts
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