Glass interposer panels and methods for making the same

Abstract

Glass interposer panels and methods for forming the same are described herein. The interposer panels include a glass substrate core formed from an ion-exchangeable glass. A first layer of compressive stress may extend from a first surface of the glass substrate into the thickness T of the glass substrate core to a first depth of layer D 1 . A second layer of compressive stress may be spaced apart from the first layer of compressive stress and extending from a second surface of the glass substrate core into the thickness T of the glass substrate core to a second depth of layer D 2 . A plurality of through-vias may extend through the thickness T of the glass substrate core. Each through-via is surrounded by an intermediate zone of compressive stress that extends from the first layer of compressive stress to the second layer of compressive stress adjacent to a sidewall of each through-via.

1 . An interposer panel for an electronic assembly, the interposer panel comprising:
 a glass substrate core formed from an ion-exchangeable glass and comprising:
 a first surface, a second surface opposite the first surface, and a thickness T; 
 a first layer of compressive stress extending from the first surface of the glass substrate core into the thickness T of the glass substrate core to a first depth of layer D 1 ; 
 a second layer of compressive stress spaced apart from the first layer of compressive stress and extending from the second surface of the glass substrate core into the thickness T of the glass substrate core to a second depth of layer D 2 ; and 
 a plurality of through-vias extending through the thickness T of the glass substrate core, wherein each through-via of the plurality of through-vias is surrounded by an intermediate zone of compressive stress extending from the first layer of compressive stress to the second layer of compressive stress adjacent to a sidewall of each through-via. 
   
     
     
         2 . The interposer panel of  claim 1 , wherein the glass substrate core is an alkali aluminosilicate glass or an aluminoborosilicate glass. 
     
     
         3 . The interposer panel of  claim 1 , wherein:
 the first depth of layer D 1  is equal to the second depth of layer D 2 ; and   the intermediate zone of compressive stress has a radial thickness R from the sidewall of the through-via, wherein the radial thickness R is equal to the first depth of layer D 1  and the second depth of layer D 2 .   
     
     
         4 . The interposer panel of  claim 3 , wherein the first depth of layer D 1 , the second depth of layer D 2  and the radial thickness R are from about 5 microns to about 100 microns. 
     
     
         5 . The interposer panel of  claim 1 , wherein a compressive stress in the first layer of compressive stress, the second layer of compressive stress and the intermediate zones of compressive stress is from about 200 MPa to about 1000 MPa. 
     
     
         6 . The interposer panel of  claim 1 , wherein the thickness T of the glass substrate core is from about 50 microns to about 1 millimeter. 
     
     
         7 . The interposer panel of  claim 1 , wherein the interposer panel comprises at least one scalloped edge. 
     
     
         8 . The interposer panel of  claim 7 , wherein scalloped portions of the at least one scalloped edge are filled with a metallic material, a polymeric material or a frit material. 
     
     
         9 .- 20 . (canceled)