US2014034281A1PendingUtilityA1
Heat dissipation mechanism
Est. expiryAug 6, 2032(~6 yrs left)· nominal 20-yr term from priority
G06F 1/20F28F 9/00
40
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Claims
Abstract
A heat dissipation mechanism is provided, comprising a main casing, an air exhaust device and a first sub-casing. The main casing includes an opening, an air outlet and a main joining portion. The air exhaust device is disposed in the main casing to exhaust air through the air outlet from the main casing. The first sub-casing includes a first through hole and a first joining portion, wherein the first through hole communicates with the opening, and the first joining portion engages with the main connecting portion, so as to fix the first sub-casing to the main casing.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A heat dissipation mechanism is provided, comprising:
a main casing, including an opening, an air outlet and a main joining portion; an air exhaust device, disposed in the main casing to exhaust air through the air outlet from the main casing; and at least a first sub-casing, including a first through hole and a first joining portion, wherein the first through hole communicates with the opening, and the first joining portion engages with the main connecting portion, so as to fix the first sub-casing to the main casing .
2 . The heat dissipation mechanism as claimed in claim 1 , wherein the heat dissipation mechanism further comprises two first sub-casings, and the main casing further comprises two openings and two main joining portions,
wherein the first sub-casings are respectively disposed on opposite sides of the main casing, the first joining portions of the first sub-casings are respectively engaged with the main joining portions, and the first through holes are respectively communicated with the openings.
3 . The heat dissipation mechanism as claimed in claim 1 , wherein the heat dissipation mechanism further comprises a second sub-casing and the first sub-casing further comprises a second joining portion, and the first and second joining portions are respectively disposed on opposite sides of the first sub-casing, and the second sub-casing includes a second through hole and a third joining portion, wherein the second through hole communicates with the first through hole, and the third joining portion engages with the second joining portion.
4 . The heat dissipation mechanism as claimed in claim 1 , wherein the heat dissipation mechanism further comprises two main casings, and one of the main casings comprises two openings, and the first sub-casing joining portions are respectively disposed on opposite sides of the first sub-casing and respectively engaged with the main casings, and the openings are communicated with the first through hole.
5 . The heat dissipation mechanism as claimed in claim 1 , wherein the heat dissipation mechanism further comprises two main casings and two first sub-casings, the main casings are engaged with each other, and the first sub-casings are disposed on opposite sides of the main casings.
6 . The heat dissipation mechanism as claimed in claim 1 , wherein the heat dissipation mechanism further comprises two main casings and two first sub-casings, the first sub-casings are engaged with each other, and the main casings are disposed on opposite sides of the first sub-casings.
7 . The heat dissipation mechanism as claimed in claim 1 , wherein the heat dissipation mechanism further comprises two main casings and two first sub-casings engaged with each other and arranged in a staggered manner.
8 . The heat dissipation mechanism as claimed in claim 1 , wherein the main joining portion is engaged with and electrically connected to the first joining portion.
9 . The heat dissipation mechanism as claimed in claim 1 , wherein the first sub-casing further comprises an air inlet, and air flows into the first sub-casing through the air inlet.
10 . The heat dissipation mechanism as claimed in claim 1 , wherein the main casing further comprises a meshed structure, disposed in the opening, and the ventilation area ratio ranges from 30%˜50%.Join the waitlist — get patent alerts
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