Wiring substrate, method for manufacturing wiring substrate, electronic device and method for manufacturing electronic device

Abstract

A wiring substrate includes: a substrate; an insulator formed in the substrate and having a through hole; an electrode formed in the substrate and provided within the through hole; and a conductor bonded to the electrode and provided within the through hole, wherein the through hole has a shape that is widened toward a direction away from the substrate, and the conductor is configured to cover the entire top surface of the electrode and has a shape that is widened toward the direction away from the substrate.

What is claimed is: 
     
         1 . A wiring substrate comprising:
 a substrate;   an insulator formed in the substrate and having a through hole;   an electrode formed in the substrate and provided within the through hole; and   a conductor bonded to the electrode and provided within the through hole,   wherein the through hole has a shape that is widened toward a direction away from the substrate, and   the conductor is configured to cover the entire top surface of the electrode and has a shape that is widened toward the direction away from the substrate.   
     
     
         2 . The wiring substrate according to  claim 1 , wherein the conductor covers the entire side surface of the electrode or a part of the side surface of the electrode. 
     
     
         3 . The wiring substrate according to  claim 1 , wherein the electrode is provided with unevenness on a bonding surface between the electrode and the conductor. 
     
     
         4 . A method for manufacturing a wiring substrate comprising:
 forming an insulator in a substrate and accommodating an electrode formed in the substrate within a through hole provided in the insulator; and   forming a conductor within the through hole to bond the conductor to the electrode,   wherein the through hole is made to have a shape that is widened toward a direction away from the substrate, and   the conductor is made to cover the entire top surface of the electrode and has a shape that is widened toward the direction away from the substrate.   
     
     
         5 . The method according to  claim 4 , wherein the conductor is made to cover the entire side surface of the electrode or a part of the side surface of the electrode. 
     
     
         6 . The method according to  claim 4 , wherein the electrode is provided with unevenness on a bonding surface of the electrode and the conductor. 
     
     
         7 . The method according to  claim 4 , wherein the position of the substrate and the position of the insulator are aligned by fitting the electrode to the through hole. 
     
     
         8 . An electronic device comprising:
 a first wiring substrate including a support substrate, an insulator formed in the support substrate and having a through hole, an electrode formed in the support substrate and provided within the through hole, and a conductor bonded to the electrode and provided within the through hole; and   a second wiring substrate,   wherein the through hole has a shape that is widened toward a direction away from the support substrate, and   the conductor is configured to cover an entire top surface of the electrode, has a shape that is widened toward the direction away from the support substrate, and is bonded to the electrode of the second wiring substrate.   
     
     
         9 . The electronic device according to  claim 8 , wherein the conductor covers the entire side surface of the electrode of the first wiring substrate or a part of the side surface of the electrode of the first wiring substrate. 
     
     
         10 . The electronic device according to  claim 8 , wherein the electrode of the first wiring substrate is provided with unevenness on a bonding surface of the electrode and the conductor of the first wiring substrate. 
     
     
         11 . A method for manufacturing an electronic device comprising:
 forming an insulator in a support substrate and accommodating an electrode formed in the support substrate included in a first wiring substrate within a through hole provided in the insulator;   forming a conductor within the through hole to bond the conductor to the electrode of the first wiring substrate; and   bonding the conductor to an electrode included in a second wiring substrate,   wherein the through hole is made to have a shape that is widened toward a direction away from the support substrate, and   the conductor is made to cover the entire top surface of the electrode and has a shape that is widened toward the direction away from the support substrate.   
     
     
         12 . The method according to  claim 11 , wherein the conductor is made to cover the entire side surface of the electrode of the first wiring substrate or a part of the side surface of the electrode of the first wiring substrate. 
     
     
         13 . The method according to  claim 11 , wherein the electrode of the first wiring substrate is provided with unevenness on a bonding surface of the electrode and the conductor of the first wiring substrate. 
     
     
         14 . The method according to  claim 11 , wherein the position of the first wiring substrate and the position of the insulator are aligned by fitting the electrode of the first wiring substrate to the through hole.