US2014020869A1PendingUtilityA1
Cooling of Personal Computers and Other Apparatus
Est. expiryJul 17, 2032(~6 yrs left)· nominal 20-yr term from priority
Inventors:Niall Thomas Davidson
G06F 1/20F28D 15/0241G06F 2200/201
23
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
Apparatus and methods for removing unwanted heat generated by apparatus such as personal computer systems and other appliances. The apparatus comprising a thermally conductive surface to which heat from heat-generating components is communicated via a heat transmitting means such as a heatpipe. The apparatus can then be cooled by contacting cooling apparatus to the thermally conductive surface. Also described are liquid cooling apparatus suitable for contacting to apparatus having thermally conductive surfaces and a method for cooling a plurality of computer systems.
Claims
exact text as granted — not AI-modifiedWhat I claim is:
1 . An apparatus comprising a thermally conductive surface configured to be contactable by an external apparatus for the purpose of communicating heat between at least one heat-generating component of the apparatus and the external apparatus, the apparatus not requiring installation into an enclosure designed to receive the apparatus for the purpose of making contact with the thermally conductive surface.
2 . The apparatus of claim 1 wherein the apparatus is electronic.
3 . The apparatus of claim 1 wherein the apparatus is a computer system.
4 . Non-portable apparatus comprising:
(a) a heat-generating component; (b) a heat-transmitting means, and; (c) a thermally conductive surface, the thermally conductive surface disposed in such a way as to be contactable by a counterpart surface of an external apparatus, the thermally conductive surface being thermally connected to the heat-generating component by the heat-transmitting means, the apparatus not requiring installation into an enclosure designed to receive the apparatus for the purpose of making contact with the thermally conductive surface.
5 . The apparatus of claim 4 wherein the apparatus is an electronics apparatus.
6 . The apparatus of claim 5 wherein the heat-generating component is an integrated circuit.
7 . The apparatus of claim 4 wherein the apparatus is an appliance.
8 . The apparatus of claim 4 wherein the apparatus is a computer system.
9 . The apparatus of claim 4 wherein the apparatus is a personal computer.
10 . The apparatus of claim 4 wherein the heat-transmitting means is a heatpipe.
11 . The method of claim 10 wherein the apparatus is a personal computer.
12 . A method of removing unwanted heat from an apparatus, the method comprising contacting an external cooling apparatus to a thermally conductive surface of the apparatus without requiring the installation of the apparatus into an enclosure.
13 . The method of claim 12 wherein the apparatus is installed in an office, home or retail environment.
14 . The method of claim 12 wherein the cooling apparatus cools the thermally conductive surface by communicating heat between the thermally conductive surface and a liquid medium.
15 . The method of claim 12 wherein the apparatus is electronic.
16 . A method of enabling the removal of unwanted heat from non-portable apparatus, the method comprising:
(a) enabling heat communication between a heat-generating component of the apparatus and a thermally conductive surface of the apparatus, and; (b) disposing the thermally conductive surface in such a way as to be contactable by a surface of an external apparatus without requiring installing the apparatus into an enclosure.
17 . The method of claim 16 wherein the apparatus is electronic.
18 . The method of claim 16 wherein the apparatus is a computer system.
19 . The method of claim 16 wherein the apparatus is intended for installation in an office, home or retail environment.
20 . The method of claim 19 wherein the apparatus is a personal computer.Join the waitlist — get patent alerts
Track US2014020869A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.