US2014018228A1PendingUtilityA1

Glass powder and method of manufacturing the same

Assignee: SAMSUNG ELECTRO MECHPriority: Jan 18, 2011Filed: Sep 16, 2013Published: Jan 16, 2014
Est. expiryJan 18, 2031(~4.5 yrs left)· nominal 20-yr term from priority
C03C 12/00C03C 8/02C03C 3/078C04B 2235/365C03B 37/00C03C 3/089C03C 14/00C04B 35/00Y10T428/2982B82Y 30/00B82Y 40/00C03C 3/064C03C 1/006
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Claims

Abstract

Provided are a glass powder represented as aLi 2 O-bK 2 O-cBaO-dB 2 O 3 -eSiO 2 wherein a+b+c+d+e=1, and 0.01≦a≦0.1, 0.01≦b≦0.01, 0.01≦c≦0.1, 0.05≦d≦0.3, and 0.3≦e≦0.7 are satisfied in terms of mol %, a method of manufacturing the same, and a multi-layered ceramic material using the same. Therefore, a nano glass powder having an average particle size of 100 nm or less and uniform particle size distribution can be manufactured using liquid phase deposition, specifically, a sol-gel method. In addition, the glass powder can be used as sintering additives to decrease a sintering temperature by about 100° C. in comparison with conventional glass upon manufacture of a ceramic material such as MLCC and MLCI, which can be sintered at a low temperature, contributing to improvement of dielectric capacity and inductance capacity of the parts and increasing quality coefficient.

Claims

exact text as granted — not AI-modified
1 - 14 . (canceled) 
     
     
         15 . A glass powder represented as the following Formula 1:
   aLi 2 O-bK 2 O-cBaO-dB 2 O 3 -eSiO 2   Formula 1
   
       wherein a+b+c+d+e=1, and 0.01≦a≦0.1, 0.01≦b≦0.1, 0.01≦c≦0.1, 0.05≦d≦0.3, and 0.3≦e≦0.7 are satisfied in terms of mol %; and
 a ceramic material that can be plasticized at a low temperature using the glass powder according to claim  1 . 
 
     
     
         16 . The ceramic material according to  claim 15 , wherein the plasticization is performed at a temperature of 1100 to 1200° C. 
     
     
         17 . The ceramic material according to  claim 15 , wherein the glass powder is used as sintering additives. 
     
     
         18 . The ceramic material according to  claim 15 , wherein the ceramic material is at least one selected from the group consisting of a multi-layered ceramic capacitor and a multi-layered chip inductor.

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