Mems device

Abstract

A method of fabricating a micro-electrical-mechanical system (MEMS) apparatus on a substrate comprises the steps of processing the substrate so as to fabricate an electronic circuit; depositing a first electrode that is operably coupled with the electronic circuit; depositing a membrane so that it is mechanically coupled to the first electrode; applying a sacrificial layer; depositing a structural layer and a second electrode that is operably coupled with the electronic circuit so that the sacrificial layer is disposed between the membrane and the structural layer so as to form a preliminary structure; singulating the substrate; and removing the sacrificial layer so as to form a MEMS structure, in which the step of singulating the substrate is carried out before the step of removing the sacrificial layer.

1 - 45 . (canceled) 
     
     
         46 . A microphone comprising:
 a substrate;   an integrated circuit positioned onto the substrate; and   an array of MEMS devices mounted on the substrate, wherein the array of MEMS devices are operably connected.   
     
     
         47 . A microphone as claimed in  claim 46 , further comprising a sound port. 
     
     
         48 . A microphone as claimed in  claim 47 , wherein each MEMS device comprises a membrane, and wherein the sound port allows the membrane to flex in response to a sound wave. 
     
     
         49 . A microphone as claimed in  claim 46 , wherein the substrate is comprised of silicon. 
     
     
         50 . A microphone as claimer in  claim 46 , further comprising an electronic circuit operably connected to the array of MEMS devices. 
     
     
         51 . A microphone as claimed in  claim 50 , wherein the electronic circuit comprises a pre-amplifier. 
     
     
         52 . A microphone as claimed in  claim 50 , wherein the electronic circuit comprises a charge-pump. 
     
     
         53 . A packaged integrated circuit arrangement comprising a microphone according to  claim 46 . 
     
     
         54 . A microphone as claimed in  claim 46 , wherein each MEMS device comprises:
 first and second electrodes;   a membrane, mechanically coupled to the first electrode; and   an air gap between the first and second electrodes, such that the membrane and the first electrode coupled thereto is able to move relative to the second electrode in response to pressure differences generated by sound waves.   
     
     
         55 . A microphone as claimed in  claim 46 , wherein the array of MEMS devices are connected electrically in parallel. 
     
     
         56 . An array comprising:
 a substrate:   a plurality of MEMS microphone devices disposed upon said substrate;   electronic circuitry;   
       wherein the devices are operably connected. 
     
     
         57 . An array as claimed in  claim 56 , wherein the electronic circuitry comprises a pre-amplifier. 
     
     
         58 . An array as claimed in  claim 56 , wherein the electronic circuitry comprises an analogue-to-digital converter. 
     
     
         59 . An array as claimed in  claim 56 , wherein the electronic circuitry comprises a digital-to-analogue converter. 
     
     
         60 . An array as claimed in  claim 56 , wherein the electronic circuitry comprises transmitting and receiving means. 
     
     
         61 . An array as claimed in  claim 56 , wherein the electronic circuitry comprises a charge-pump. 
     
     
         62 . An array as claimed in  claim 56 , further comprising a sound port. 
     
     
         63 . An array comprising:
 a substrate:   a plurality of MEMS microphone devices disposed upon said substrate;   electronic circuitry;   
       wherein the devices are operably connected to provide a directionally selective microphone.