Method for forming metal member on casing

Abstract

A method for forming metal members on a casing, includes steps of providing the casing of an electron device; selecting at least two areas on a common surface of the casing; forming, by an electroplating way, a metal layer on all of the selected areas; and forming, by a patterning way, the metal layer respectively with different metal member pattern layers on different selected areas, wherein the metal member pattern layers are selected from the group consisting of an antenna member pattern, a ground wire member pattern, and an electromagnetic shielding member pattern, so as to use these members as an antenna member, a ground wire member, or an electromagnetic shielding member of the electron device.

What is claimed is: 
     
         1 . A method for forming metal members on a casing, comprising steps of:
 (a) providing the casing of an electron device;   (b) selecting at least two areas on a common surface of the casing;   (c) forming, by an electroplating way, a metal layer on all of the selected areas; and   (d) forming, by a patterning way, the metal layer respectively with different metal member pattern layers on different selected areas, wherein the metal member pattern layers are selected from the group consisting of an antenna member pattern, a ground wire member pattern, and an electromagnetic shielding member pattern.   
     
     
         2 . The method as claimed in  claim 1 , wherein in step (a), the casing is made of an insulating material. 
     
     
         3 . The method as claimed in  claim 1 , wherein in step (b), the common surface is an inner side surface of the casing. 
     
     
         4 . The method as claimed in  claim 1 , further comprising, before step (c), a step of forming a medium layer for electroplating on the common surface. 
     
     
         5 . The method as claimed in  claim 1 , wherein in step (c), the metal layer is a copper layer. 
     
     
         6 . The method as claimed in  claim 1 , wherein in step (d), the patterning way includes:
 (d1) a photoresist forming process;   (d2) an exposure process;   (d3) a developing process; and   (d4) an etching process.   
     
     
         7 . The method as claimed in  claim 1 , further comprising, after step (d), a step of forming, by a chemical plating way, a protective layer on the metal member pattern layers. 
     
     
         8 . The method as claimed in  claim 7 , wherein the protective layer is a nickel layer or a gold layer.