Subfloor component and method of manufacturing same

Abstract

A method of manufacturing a subfloor component, comprises: providing a mold configured to form an insulating foam panel, and including pedestal-forming structures for forming the panel to have, in cross-section, a plurality of pedestals with walls that extend into the panel from a first face toward a second opposing face; placing a moisture-resistant film into the mold adjacent to the pedestal-forming structures; placing heat-expandable beads into the mold against the moisture-resistant film opposite the pedestal-forming structures; applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes both the film and the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel with the moisture-resistant film fused thereto; removing the panel with the fused moisture-resistant film from the mold; and attaching a hardboard layer to the second face.

What is claimed is: 
     
         1 . A method of manufacturing a subfloor component, comprising:
 providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a plurality of pedestals with walls that extend into the panel from a first face of the panel toward a second opposing face of the panel;   placing a moisture-resistant film into the mold adjacent to the pedestal-forming structures;   placing heat-expandable beads into the mold against the moisture-resistant film opposite the pedestal-forming structures;   applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes both the film and the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel with the moisture-resistant film fused thereto;   removing the panel with the fused moisture-resistant film from the mold; and   attaching a hardboard layer to the second face of the panel.   
     
     
         2 . The method of  claim 1 , wherein the heat-expandable beads are expandable polystyrene (EPS) beads. 
     
     
         3 . The method of  claim 2 , wherein the moisture-resistant film comprises a material selected from the group consisting of: high-impact polystyrene, polyethylene, and ABS (Acrylonitrile Butadiene Styrene). 
     
     
         4 . The method of  claim 1 , wherein attaching the hardboard layer comprises applying adhesive to one or both of the hardboard layer and the second face of the panel. 
     
     
         5 . The method of  claim 1 , wherein the hardboard layer comprises material selected from the group consisting of: OSB (oriented strand board), plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board. 
     
     
         6 . The method of  claim 1 , further comprising:
 shaping the hardboard layer with a tongue/groove configuration for connecting to another hardboard layer of another subfloor component.   
     
     
         7 . The method of  claim 1 , further comprising:
 forming grooves on at least two sides of said hardboard layer, each groove for connecting to at least one connector.   
     
     
         8 . The method of  claim 7 , wherein each connector is a connector strip comprising opposing tongues, the connector strip being configured for connecting adjacent subfloor components. 
     
     
         9 . The method of  claim 7 , wherein said forming comprises forming grooves on four sides of said hardboard layer. 
     
     
         10 . A method of manufacturing a subfloor component, comprising:
 providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a plurality of pedestals with walls that extend into the panel from a first face of the panel toward a second opposing face of the panel;   placing heat-expandable beads into the mold against the pedestal-forming structures;   applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel;   placing a moisture-resistant film into the mold adjacent to the pedestal-forming structures;   applying heat to the mold to fuse the film to the panel, the heat causing the film to enter into and conform to the pedestals and fuse thereto;   removing the panel with the fused moisture-resistant film from the mold; and   attaching a hardboard layer to the second face of the panel.   
     
     
         11 . The method of  claim 10 , wherein the heat-expandable beads are expandable polystyrene (EPS) beads. 
     
     
         12 . The method of  claim 11 , wherein the moisture-resistant film comprises a material selected from the group consisting of: high-impact polystyrene, polyethylene, and ABS (Acrylonitrile Butadiene Styrene). 
     
     
         13 . The method of  claim 10 , wherein attaching the hardboard layer comprises applying adhesive to one or both of the hardboard layer and the second face of the panel. 
     
     
         14 . The method of  claim 10 , wherein the hardboard layer comprises material selected from the group consisting of: OSB (oriented strand board), plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board. 
     
     
         15 . The method of  claim 10 , further comprising:
 shaping the hardboard layer with a tongue/groove configuration for connecting to another hardboard layer of another subfloor component.   
     
     
         16 . The method of  claim 10 , further comprising:
 forming grooves on at least two sides of said hardboard layer, each groove for connecting to at least one connector.   
     
     
         17 . The method of  claim 16 , wherein each connector is a connector strip comprising opposing tongues, the connector strip being configured for connecting adjacent subfloor components. 
     
     
         18 . The method of  claim 16 , wherein said forming comprises forming grooves on four sides of said hardboard layer. 
     
     
         19 . A method of manufacturing a subfloor component, comprising:
 providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a plurality of pedestals with walls that extend into the panel from a first face of the panel toward a second opposing face of the panel;   placing heat-expandable beads into the mold against the pedestal-forming structures;   applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel;   removing the panel from the mold;   placing a moisture-resistant film adjacent the first face of the panel;   applying heat to one or both of the moisture-resistant film and the panel, the heat causing the film to enter into and conform to the pedestals and fuse thereto; and   attaching a hardboard layer to the second face of the panel.   
     
     
         20 . The method of  claim 19 , wherein said placing comprises placing the moisture-resistant film in contact with and/or in non-contact proximity with the first face of the panel. 
     
     
         21 . The method of  claim 19 , wherein the heat-expandable beads are expandable polystyrene (EPS) beads. 
     
     
         22 . The method of  claim 21 , wherein the moisture-resistant film comprises a material selected from the group consisting of: high-impact polystyrene, polyethylene, and ABS (Acrylonitrile Butadiene Styrene). 
     
     
         23 . The method of  claim 19 , wherein attaching the hardboard layer comprises applying adhesive to one or both of the hardboard layer and the second face of the panel. 
     
     
         24 . The method of  claim 19 , wherein the hardboard layer comprises material selected from the group consisting of: OSB (oriented strand board), plywood, fiber cement board, cement board, metal sheeting, and magnesium oxide board. 
     
     
         25 . The method of  claim 19 , further comprising:
 shaping the hardboard layer with a tongue/groove configuration for connecting to another hardboard layer of another subfloor component.   
     
     
         26 . The method of  claim 19 , further comprising:
 forming grooves on at least two sides of said hardboard layer, each groove for connecting to at least one connector.   
     
     
         27 . The method of  claim 26 , wherein each connector is a connector strip comprising opposing tongues, the connector strip being configured for connecting adjacent subfloor components. 
     
     
         28 . The method of  claim 26 , wherein said forming comprises forming grooves on four sides of said hardboard layer.