Inclusion complex containing epoxy resin composition for semiconductor encapsulation

Abstract

A solid semiconductor sealing composition that includes (A) an epoxy resin, and (B) a clathrate complex. The clathrate complex contains (b1) at least one of 5-hydroxyisophthalic acid and 5-nitroisophthalic acid; and (b2) at least one of 2-ethyl-4-methylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole. A method of sealing a solid semiconductor using the sealing composition.

1 . A method of sealing a semiconductor comprising:
 applying to the semiconductor a composition comprising:
 (A) an epoxy resin; and 
 (B) a clathrate complex comprising:
 (b1) at least one of 5-hydroxyisophthalic acid and 5-nitroisophthalic acid, and 
 (b2) at least one of 2-ethyl-4-methylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole. 
 
   
     
     
         2 . A solid semiconductor sealing composition comprising:
 (A) an epoxy resin;   (B) a clathrate complex comprising:
 (b1) at least one of 5-hydroxyisophthalic acid and 5-nitroisophthalic acid; and 
 (b2) at least one of 2-ethyl-4-methylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole; and 
   (C) an inorganic filler.   
     
     
         3 . The solid semiconductor sealing composition according to  claim 2 , wherein the inorganic filler is present in an amount of 70 to 95 wt % with respect to a total weight of the sealing composition.