Apparatus and method for repairing broken line of array substrate

Abstract

The present invention provides an apparatus and a method for repairing a broken line of an array substrate. The apparatus includes a repair unit and a heating unit. The repair unit forms a repair line on a broken-line defect of a wire on the array substrate. The heating unit heats the repair line, so that the molecules constituting the repair line are arranged in sequence according a predetermined rule. The present invention can achieve the repair for a longer broken-line defect.

What is claimed is: 
     
         1 . A repair apparatus for a broken line of an array substrate, comprising:
 a repair unit for forming a repair line on a broken-line defect of a wire on the array substrate for connecting the wire; and   a heating unit for making a surface of the repair line reach a predetermined temperature, so as to heat the repair line formed by the repair unit.   
     
     
         2 . The repair apparatus of  claim 1 , wherein the repair unit specifically comprising:
 a removal module for removing a protective layer on both ends of the broken-line defect to expose the both ends of the broken-line defect; and   a plated-wire module for forming the repair line on the broken-line defect by using a repair material for connecting the wire.   
     
     
         3 . The repair apparatus of  claim 2 , wherein the repair material is chromium hexacarbonyl. 
     
     
         4 . The repair apparatus of  claim 2 , wherein the repair material is molybdenum hexacarbonyl. 
     
     
         5 . The repair apparatus of  claim 2 , wherein the repair material is tungsten hexacarbonyl. 
     
     
         6 . The repair apparatus of  claim 1 , wherein the heating unit is further utilized to heat the repair line formed by the repair unit through laser beams. 
     
     
         7 . The repair apparatus of  claim 1 , wherein the predetermined temperature is larger than a melting point of the repair material and less than a boiling point of the repair material. 
     
     
         8 . A repair apparatus for a broken line of an array substrate, comprising:
 a repair unit for forming a repair line on a broken-line defect of a wire on the array substrate; and   a heating unit for heating the repair line formed by the repair unit.   
     
     
         9 . The repair apparatus of  claim 8 , wherein the repair unit specifically comprising:
 a removal module for removing a protective layer on both ends of the broken-line defect to expose the both ends of the broken-line defect; and   a plated-wire module for forming the repair line on the broken-line defect by using a repair material for connecting the wire.   
     
     
         10 . The repair apparatus of  claim 9 , wherein the repair material is chromium hexacarbonyl. 
     
     
         11 . The repair apparatus of  claim 9 , wherein the repair material is molybdenum hexacarbonyl. 
     
     
         12 . The repair apparatus of  claim 9 , wherein the repair material is tungsten hexacarbonyl. 
     
     
         13 . The repair apparatus of  claim 8 , wherein the heating unit is further utilized to heat the repair line formed by the repair unit through laser beams. 
     
     
         14 . The repair apparatus of  claim 8 , wherein a heating unit is further utilized to make a surface of the repair line reach a predetermined temperature, wherein the predetermined temperature is larger than a melting point of the repair material and less than a boiling point of the repair material. 
     
     
         15 . A method for repairing a broken line of an array substrate, the method comprising the following steps of:
 forming a repair line on a broken-line defect of a wire on the array substrate; and   heating the formed repair line.   
     
     
         16 . The method of  claim 15 , wherein the step of forming the repair line on the broken-line defect of the wire on the array substrate specifically comprises:
 removing a protective layer on both ends of the broken-line defect to expose the both ends of the broken-line defect; and   forming the repair line on the broken-line defect by using a repair material for connecting the wire.   
     
     
         17 . The method of  claim 16 , wherein the repair material is chromium hexacarbonyl, molybdenum hexacarbonyl, or tungsten hexacarbonyl. 
     
     
         18 . The method of  claim 15 , wherein the step of heating the formed repair line specifically comprises:
 heating the formed repair line by a laser beam heat treatment.   
     
     
         19 . The method of  claim 15 , wherein the step of heating the formed repair line specifically comprises:
 making a surface of the repair line reach a predetermined temperature, wherein the predetermined temperature is larger than a melting point of the repair material and less than a boiling point of the repair material.