Plate for heat exchanger, heat exchanger and air cooler comprising a heat exchanger

Abstract

The present invention relates to a plate ( 1 ) for a heat exchanger for heat exchange between a first and a second medium. The plate has a first side (A) and an opposing second side (B). The said first side (A) is configured with at least one heat transferring elevation ( 2 ) and with at least one heat transfer surface ( 4 ) surrounding the elevation. Dimples ( 5; 7 ) are provided at either or both of the heat transferring elevation ( 2 ) and the heat transfer surface ( 4 ) to permit provision of a through-flow duct (X) for the first medium. The second side (B) is configured with at least one heat transferring depression ( 3 ) corresponding to the elevation. The depression being configured to define a part of a through-flow duct (Y) for the second medium. The second side (B) is configured with at least one bonding surface ( 6 ) corresponding to the heat transfer surface and surrounding the depression. The present invention also relates to a heat exchanger including a stack of the above-mentioned plates and to an air cooler comprising such a heat exchanger.

1 . A plate for a heat exchanger for heat exchange between a first and a second medium, the plate comprising:
 a first side (A) and an opposing second side (B),   wherein the first side (A) of said plate ( 1 ) is configured with at least one heat transferring elevation ( 2 ) and with at least one heat transfer surface ( 4 ) surrounding said elevation,   wherein dimples ( 5 ;  7 ) are provided at either or both of the heat transferring elevation ( 2 ) and the heat transfer surface ( 4 ) to permit provision of a through-flow duct (X) for the first medium, and   wherein the second side (B) of said plate ( 1 ) is configured with at least one heat transferring depression ( 3 ) corresponding to said elevation ( 2 ), said depression being configured to define a part of a through-flow duct (Y) for the second medium, and with at least one bonding surface ( 6 ) corresponding to said heat transfer surface ( 4 ) and surrounding said depression.   
     
     
         2 . A plate according to  claim 1 ,
 wherein the heat transferring elevation ( 2 ) on the first side (A) of the plate ( 1 ) has a first height (h 1 ) corresponding to a depth of the heat transferring depression ( 3 ) on the second side (B) of the plate, and   wherein the heat transferring elevation ( 2 ) has a width (w) corresponding to a width of the heat transferring depression ( 3 ).   
     
     
         3 . A plate according to  claim 2 ,
 wherein the dimples ( 5 ) provided on the heat transfer surface ( 4 ) on the first side (A) of the plate ( 1 ) has a second height (h 2 ) which is larger than said first height (h 1 ), and/or   wherein the dimples ( 7 ) provided on the heat transferring elevation ( 2 ) on said first side (A) of the plate ( 1 ) has a height (h 2 -h 1 ) which together with the height (h 1 ) of the elevation is larger than said first height (h 1 ).   
     
     
         4 . A plate according to  claim 2 , wherein the width (w) of the heat transferring elevation ( 2 ) and of the corresponding heat transferring depression ( 3 ) is at least  5  times larger than said first height (h 1 ) of said heat transferring elevation and the depth of said corresponding heat transferring depression. 
     
     
         5 . A plate according to  claim 4 , wherein the heat transferring elevation ( 2 ) on the first side (A) of the plate ( 1 ) and the corresponding heat transferring depression ( 3 ) on the second side (B) of the plate are configured with two or more straight, parallel or substantially parallel portions. 
     
     
         6 . A plate according to  claims 2 , wherein the heat transferring depression ( 3 ) on the second side (B) of the plate ( 1 ) is provided with pressure resisting dimples ( 8 ) with a height corresponding to said first height (h 1 ) of the heat transferring elevation ( 2 ) and the depth of said corresponding heat transferring depression. 
     
     
         7 . A plate according to  claims 2 , wherein the heat transfer surface ( 4 ) on the first side (A) of the plate ( 1 ) is provided with reinforcing dimples ( 9 ). 
     
     
         8 . A plate according to  claim 3 , wherein the plate ( 1 ) is configured with first and second portholes ( 10  and  11 ) for the second medium, each of said portholes ( 10 ,  11 ) being on said first side (A) of the plate ( 1 ) configured with an edge ( 10   a ,  11   a ) which surrounds said porthole, said edge forming part of said heat transferring elevation ( 2 ) and having a height corresponding to said second height (h 2 ) of the dimples ( 5 ) and/or corresponding to the height (h 2 -h 1 ) of the dimples ( 7 ) provided on the heat transferring elevation ( 2 ) together with the height (h 1 ) of said heat transferring elevation. 
     
     
         9 . A heat exchanger for heat exchange between a first and a second medium, wherein said heat exchanger comprising:
 a stack of plates ( 1 ) according to  claim 1 , and   wherein said plates ( 1 ) are arranged such that the first side (A) of each plate is abutting the first side (A) of an adjacent plate ( 1 ) in the stack, thereby providing, by means of the dimples ( 5 ;  7 ) on either or both of the heat transfer surfaces ( 4 ) or the heat transferring elevations ( 2 ) on the first sides (A) of two adjacent plates in the stack, the through-flow duct (X) for the first medium between said first sides of said plates, and such that the second side (B) of each plate ( 1 ) is abutting the second side (B) of an adjacent plate ( 1 ) in the stack, thereby defining, by means of the heat transferring depressions ( 3 ) on the second sides (B) of two adjacent plates in the stack, at least one through-flow duct (Y) for the second medium between said second sides of said plates.   
     
     
         10 . A heat exchanger according to  claim 9 , wherein the first sides (A) of two adjacent plates ( 1 ) in the stack are assembled at opposing dimples ( 5 ;  7 ) on either or both of the heat transfer surfaces ( 4 ) and the heat transferring elevations ( 2 ) on said first sides, and assembled at opposing edges ( 10   a ,  11   a ) on said first sides surrounding portholes ( 10 ,  11 ) for the second medium in the plates by leak-free bonding of said edges to each other. 
     
     
         11 . A heat exchanger according to  claim 9 , wherein the second sides (B) of two adjacent plates ( 1 ) in the stack are assembled by leak-free bonding of opposing bonding surfaces ( 6 ) on said second sides to each other. 
     
     
         12 . A heat exchanger according to  claim 9 , wherein straight, parallel or substantially parallel portions of the heat transferring depressions ( 3 ) on the second sides (B) of two adjacent plates ( 1 ) defining the through-flow duct (Y) for the second medium extend in a first direction (D 1 ) of the plate, and
 wherein the through-flow duct (X) for the first medium provided between the first sides (A) of two adjacent plates ( 1 ) extends in a second direction (D 2 ) of the plate which is substantially perpendicular to said first direction (D 1 ).   
     
     
         13 . A heat exchanger according to  claim 9 , wherein the stack of plates ( 1 ) of the heat exchanger is located in a frame work ( 12 ) with opposing plate elements ( 13  and  14 ). 
     
     
         14 . A heat exchanger according to  claim 13 , wherein at least one of the opposing plate elements ( 13 ,  14 ) is provided with pipe connections ( 15  and  16 ) for the second medium. 
     
     
         15 . An air cooler comprising a heat exchanger according to  claim 9 , wherein the first medium is air and the second medium is a liquid.