Liquid-cooling heat dissipation apparatus for electronic elements

Abstract

A liquid-cooling heat dissipation apparatus for electronic elements comprises an air fan and a liquid-cooling heat dissipation module. The air fan includes a frame and a vane installed on the frame to provide cooling airflow. The liquid-cooling heat dissipation module includes a liquid delivery duct, a liquid return duct, a heat collection element connected to the liquid delivery duct and liquid return duct and coupled with an electronic element to absorb heat, a heat dissipation element to receive the heat from the heat collection element through the liquid return duct and receive the cooling airflow to lower the heat, and a liquid delivery element to provide kinetic energy to drive circulation of the heat from the liquid delivery duct to the liquid return duct. The heat dissipation element and liquid delivery element form a housing space to hold the vane of the air fan.

What is claimed is: 
     
         1 . A liquid-cooling heat dissipation apparatus for electronic elements, comprising:
 an air fan including a frame and a vane installed on the frame to provide cooling airflow; and   a liquid-cooling heat dissipation module including a liquid delivery duct and a liquid return duct, a heat collection element connecting to the liquid delivery duct and the liquid return duct and coupling with an electronic element to absorb heat, a heat dissipation element to receive the heat from the heat collection element via the liquid return duct and receive the cooling airflow to lower the heat, and a liquid delivery element to provide kinetic energy to drive circulation of the heat from the liquid return duct to the liquid delivery duct;   wherein the heat dissipation element and the liquid delivery element form a housing space between them to hold the vane of the air fan.   
     
     
         2 . The liquid-cooling heat dissipation apparatus of  claim 1 , wherein the liquid delivery element is installed on one side of the air fan opposing the heat dissipation element and formed at a diameter smaller than that of the vane. 
     
     
         3 . The liquid-cooling heat dissipation apparatus of  claim 2 , wherein the liquid delivery element is located in a center of the vane. 
     
     
         4 . The liquid-cooling heat dissipation apparatus of  claim 1 , wherein the liquid delivery element is installed on one side of the air fan via the liquid delivery duct and the liquid return duct that serve as support racks. 
     
     
         5 . The liquid-cooling heat dissipation apparatus of  claim 4 , wherein the frame of the air fan is fastened to the heat dissipation element through fastening elements and interposed between the heat dissipation element and the liquid delivery element. 
     
     
         6 . The liquid-cooling heat dissipation apparatus of  claim 1 , wherein the frame of the air fan is extended to form a housing portion between the frame and the vane to hold the liquid delivery element. 
     
     
         7 . The liquid-cooling heat dissipation apparatus of  claim 6 , wherein the vane of the air fan and the liquid delivery element are coupled on a same drive bearing. 
     
     
         8 . The liquid-cooling heat dissipation apparatus of  claim 6 , wherein the frame of the air fan is fastened to the heat dissipation element through fastening elements. 
     
     
         9 . The liquid-cooling heat dissipation apparatus of  claim 1 , wherein the frame of the air fan is extended to form a housing portion on one side opposing the vane to hold the liquid delivery element. 
     
     
         10 . The liquid-cooling heat dissipation apparatus of  claim 9 , wherein the vane of the air fan and the liquid delivery element are coupled on a same drive bearing. 
     
     
         11 . The liquid-cooling heat dissipation apparatus of  claim 9 , wherein the frame of the air fan is fastened to the heat dissipation element through fastening elements.