Printed circuit board and method of fabricating the same

Abstract

Disclosed is a printed circuit board, which includes an insulating member having a circuit pattern embedded in one surface thereof, a bump pad formed in the insulating member so as to be connected to the circuit pattern and protruding from an outer surface of the insulating member, a build-up layer formed on one surface of the insulating member and including a build-up insulating layer and a circuit layer formed in the build-up insulating layer and having a via connected to the circuit pattern, and a solder resist layer formed on the build-up layer. A method of fabricating the printed circuit board is also provided. The printed circuit board is fabricated using a build-up process and the outermost circuit layer thereof is formed to have an embedded structure using an imprinting process, thus minimizing the separation of the circuit layer and reducing the lead time and the fabrication cost.

1 . A printed circuit board, comprising: an insulating member having a circuit pattern embedded in one surface thereof; a bump pad formed in the insulating member so as to be connected to the circuit pattern and protruding from an outer surface of the insulating member; a build-up layer formed on one surface of the insulating member and including a build-up insulating layer and a circuit layer formed in the build-up insulating layer and having a via connected to the circuit pattern; and a solder resist layer formed on the build-up layer. 
     
     
         2 . The printed circuit board as set forth in  claim 1 , wherein a pattern trench is formed in a portion of the insulating member in a thickness direction, and thus the circuit pattern is formed in the pattern trench. 
     
     
         3 . The printed circuit board as set forth in  claim 1 , wherein the bump pad is formed such that a lower portion thereof is embedded in the insulating member and an upper portion thereof protrudes from the insulating member. 
     
     
         4 . The printed circuit board as set forth in  claim 1 , wherein the bump pad comprises a plating layer. 
     
     
         5 . The printed circuit board as set forth in  claim 1 , wherein a surface treatment layer is formed on a surface of the bump pad protruding from the outer surface of the insulating member. 
     
     
         6 . The printed circuit board as set forth in  claim 1 , wherein an opening for exposing a pad of the circuit layer is formed in the solder resist layer. 
     
     
         7 - 12 . (canceled)