Heat-dissipating module for digital light processing projector

Abstract

A heat-dissipating module includes a thermal conduction structure, at least one heat pipe, and plural fins. The thermal conduction structure includes a connecting part. The connecting part has a first surface and a second surface opposed to the first surface. The first surface is contacted with a digital micromirror device. The heat pipe includes a penetrating part and a suspension arm. The penetrating part runs through the connecting part of the thermal conduction structure from the second surface to the first surface. The penetrating part is contacted with the digital micromirror device. The plural fins are contacted with the suspension arm. After the heat generated by the digital micromirror device is transferred to the suspension arm through the thermal conduction structure and the penetrating part, the heat is transferred from the plural fins to the plural fins and then dissipated to surroundings through the plural fins.

What is claimed is: 
     
         1 . A heat-dissipating module for a digital light processing projector, said digital light processing projector comprising a digital micromirror device, said heat-dissipating module comprising:
 a thermal conduction structure comprising a connecting part, wherein said connecting part has a first surface and a second surface opposed to said first surface, wherein said first surface is contacted with said digital micromirror device;   at least one heat pipe comprising a penetrating part and a suspension arm, wherein said suspension arm is connected with said penetrating part, wherein said penetrating part runs through said connecting part of said thermal conduction structure from said second surface to said first surface, and said penetrating part is contacted with said digital micromirror device; and   a plurality of fins contacted with said suspension arm,   wherein after the heat generated by said digital micromirror device is transferred to said suspension arm of said heat pipe through said thermal conduction structure and said penetrating part of said heat pipe, the heat is transferred from said suspension arm to said plural fins and then dissipated to surroundings through said plural fins.   
     
     
         2 . The heat-dissipating module according to  claim 1 , wherein said penetrating part of said heat pipe has a terminal surface, wherein said terminal surface of said penetrating part is coplanar with said first surface of said connecting part, and said terminal surface of said penetrating part is contacted with said digital micromirror device. 
     
     
         3 . The heat-dissipating module according to  claim 1 , wherein said digital micromirror device comprises a digital micromirror chip, wherein said first surface of said connecting part and said penetrating part of said heat pipe are contacted with said digital micromirror chip. 
     
     
         4 . The heat-dissipating module according to  claim 1 , wherein said suspension arm of said heat pipe comprises a first extension segment, a bent segment and a second extension segment, wherein said first extension segment is connected with said penetrating part, said bent segment is connected with said first extension segment and said second extension segment, and said first extension segment and said second extension segment are contacted with said plural fins. 
     
     
         5 . The heat-dissipating module according to  claim 4 , wherein said first extension segment and said second extension segment are parallel with each other. 
     
     
         6 . The heat-dissipating module according to  claim 1 , wherein said thermal conduction structure further comprises a base, wherein said base is connected with said connecting part, and said base has a third surface and a fourth surface opposed to said third surface, wherein said third surface of said base is connected with said second surface of said connecting part. 
     
     
         7 . The heat-dissipating module according to  claim 6 , wherein after said penetrating part runs through said base from said fourth surface to said third surface, said penetrating part runs through said connecting part of said thermal conduction structure from said second surface to said first surface, and said penetrating part is contacted with said digital micromirror device. 
     
     
         8 . The heat-dissipating module according to  claim 6 , wherein said base further comprises plural heat-dissipating slices, which are extended from said fourth surface of said base. 
     
     
         9 . The heat-dissipating module according to  claim 6 , wherein said base further a frame for supporting said plural fins, and said frame has plural positioning structures for facilitating positioning said heat-dissipating module. 
     
     
         10 . The heat-dissipating module according to  claim 1 , wherein said connecting part of said thermal conduction structure and said digital micromirror device are connected with each other through an adhesive, wherein said adhesive is an insulated and thermally-conductive adhesive.