Layout for electronic component to be cooled, chamber containing the layout, vacuum cooling system including chamber, method of using the vacuum cooling system

Abstract

The layout for an electronic component to be cooled during operation, said layout comprises a support ( 1 ) on which the electronic component ( 16 ) will be mounted, a base ( 2 ) configured so that it will be cooled, and a connecting element ( 3 ) mechanically and thermally connecting the base ( 2 ) to the support ( 1 ) so as to cool it. The connecting element ( 3 ) is configured such that the support ( 1 ) is free to move relative to the base ( 2 ), and the layout comprises a displacement adjustment system ( 4 ) configured so as to apply a movement to said support ( 1 ) relative to the base.

1 . A layout for an electronic component to be cooled during operation, said layout comprising:
 a support for mounting the electronic component,   a base configured to be cooled,   a connecting element mechanically and thermally connecting the base to the support so as to cool said base,   wherein said connecting element is configured such that the support is free to move relative to the base, and further comprising a displacement adjustment system configured to apply a movement to said support relative to the base.   
     
     
         2 . A layout according to  claim 1 , wherein the connecting element is at least partly deformable. 
     
     
         3 . A layout according to  claim 2 , wherein the connecting element comprises two end devices connected to each other through a deformable element, one of the end devices being fixed to the base and the other end device being fixed to the support. 
     
     
         4 . A layout according to  claim 3 , wherein the deformable element is a braid made from a heat conducting material. 
     
     
         5 . A layout according to  claim 3 , wherein the thermal conductivity of the deformable element is greater than or equal to 300 W.m −1 .K −1 . 
     
     
         6 . A layout according to  claim 1 , wherein the displacement adjustment system comprises a displacement element in contact with the support, said displacement element being configured to limit the input of heat derived from the displacement adjustment system to said support. 
     
     
         7 . A layout according to  claim 6 , wherein the thermal conductivity of the displacement element is at least 100 times less than the thermal conductivity of the connecting element. 
     
     
         8 . A layout according to  claim 6 , wherein the displacement adjustment system comprises a motor drive device comprising piezoelectric motors, said motor drive device being configured to apply a movement to the displacement element. 
     
     
         9 . A layout according to  claim 1 , wherein the movement of the support is inscribed in a plane. 
     
     
         10 . A vacuum cooling chamber comprising a layout according to  claim 1 . 
     
     
         11 . A chamber according to  claim 10 , wherein the base is fixed relative to an internal cavity of the chamber inside which the base, the connecting element and the support extend. 
     
     
         12 . A chamber comprising a layout according to  claim 8 , wherein said motor drive device is located inside the chamber, or outside the chamber. 
     
     
         13 . A chamber according to  claim 11 , wherein the motor drive device is located in the internal cavity, and is fixed to a plate in the chamber, said plate being fixed to a wall delimiting the internal cavity so as to keep the operating temperature of the motor drive device at the ambient temperature of the internal cavity. 
     
     
         14 . A vacuum cooling system comprising a chamber according to  claim 10  and an electronic component configured to measure at least one wavelength parameter installed on the support, said system comprising a cooling device configured to cool the base. 
     
     
         15 . A method of using a vacuum cooling system according to  claim 14 , said method comprising an operating step of the electronic component made during a cooling step configured so as to keep the temperature of the electronic component within an operating temperature range. 
     
     
         16 . A method according to  claim 15 , further comprising a step to detect vibrations applied to the support, and a step to adjust displacement of the support using the displacement adjustment system as a function of the detected vibrations in order to eliminate said vibrations to stabilise the electronic component at least during the operating step.