Heat dissipating structure, heat dissipating pad, and heat dissipating bag

Abstract

A heat dissipating structure, a heat dissipating pad, and a heat dissipating bag which enable heat generated from an electronic device to be dissipated are introduced. The heat dissipating structure includes a substrate and a heat dissipating body disposed thereon. The heat dissipating body has a main rib and a plurality of auxiliary ribs. The main rib is half-wave shaped and protrudes from the substrate periodically. The auxiliary ribs flank the main rib to form a plurality of heat dissipating grooves therebetween and define a ratio. The heat dissipating pad and a plurality of heat dissipating bodies are alternately disposed on a substrate to effectuate heat dissipation. The heat dissipating bag not only dissipates heat generated from the electronic device but also contains the electronic device.

What is claimed is: 
     
         1 . A heat dissipating structure for removing heat generated from an electronic device, the heat dissipating structure comprising:
 a substrate;   a heat dissipating body disposed on the substrate and having a main rib and a plurality of auxiliary ribs, and   wherein the main rib is half-wave shaped, protrudes from the substrate periodically, and occupies a plurality of main rib peak regions and a plurality of main rib trough regions which are defined on the substrate,   wherein the auxiliary ribs flank the main rib to form a plurality of heat dissipating grooves therebetween, the auxiliary ribs being spaced apart from each other and occupying a plurality of auxiliary rib peak regions and a plurality of auxiliary rib trough regions defined on the substrate, the auxiliary rib peak region corresponding in position to the main rib peak region, and the auxiliary rib trough region corresponding in position to the main rib trough region,   wherein a distance between the main rib and each of the auxiliary ribs determines a ratio of an area of the auxiliary rib peak region to an area of the main rib peak region.   
     
     
         2 . The heat dissipating structure of  claim 1 , wherein a width of the heat dissipating grooves is equal to a distance spacing apart the main rib and the nearest ones of the auxiliary ribs thereto and spacing apart two adjacent ones of the auxiliary ribs. 
     
     
         3 . The heat dissipating structure of  claim 1 , wherein a fixed distance spaces apart the main rib and the nearest ones of the auxiliary ribs thereto and spaces apart two adjacent ones of the auxiliary ribs. 
     
     
         4 . The heat dissipating structure of  claim 1 , wherein the main rib and the auxiliary ribs are made of a material manifesting at least one of resilience, plasticity, and flexibility. 
     
     
         5 . A heat dissipating pad for removing heat generated from an electronic device, the heat dissipating pad comprising:
 a substrate;   a first heat dissipating body disposed on a side of the substrate and having a first main rib and a plurality of first auxiliary ribs,   wherein the first main rib is half-wave shaped, protrudes from the substrate with a first period, and occupies a plurality of first peak regions and a plurality of first trough regions defined on the substrate,   wherein the first auxiliary ribs flank the first main rib such that the first auxiliary ribs are spaced apart by a space width and occupy a plurality of first auxiliary rib peak regions and a plurality of first auxiliary rib trough regions defined on the substrate, the first auxiliary rib peak region corresponding in position to the first main rib peak region, and the first auxiliary rib trough region corresponding in position to the first main rib trough region,   wherein a distance between the first main rib and each of the first auxiliary ribs determines a ratio of an area of the first auxiliary rib peak region to an area of the first main rib peak region; and   a second heat dissipating body disposed on a side of the substrate and positioned proximate to the first heat dissipating body, the second heat dissipating body comprising a second main rib and a plurality of second auxiliary ribs,   wherein the second main rib is half-wave shaped, protrudes from the substrate with a second period, and occupies a plurality of second main rib peak regions and a plurality of second main rib trough regions defined on the substrate,   wherein the second auxiliary ribs flank the second main rib such that the second auxiliary ribs are spaced apart by a space width and occupy a plurality of second auxiliary rib peak regions and a plurality of second auxiliary rib trough regions defined on the substrate, the second auxiliary rib peak region corresponding in position to the second main rib peak region, the second auxiliary rib trough region corresponding in position to the second main rib trough region,   wherein a distance between the second main rib and each of the second auxiliary ribs determines a ratio of an area of the second auxiliary rib peak region to an area of the second main rib peak region,   wherein the second period differs from the first period by an angle.   
     
     
         6 . The heat dissipating pad of  claim 5 , wherein the angle is 90 degrees for allowing the first main rib peak region to correspond in position to the second auxiliary rib trough region and allowing the first main rib trough region to correspond in position to the second auxiliary rib peak region. 
     
     
         7 . The heat dissipating pad of  claim 5 , further comprising an anti-slip layer formed on the substrate, wherein the first heat dissipating body and the second heat dissipating body are formed on the same side of the substrate, and the anti-slip layer is formed on an opposing side of the substrate. 
     
     
         8 . The heat dissipating pad of  claim 7 , wherein the anti-slip layer comprises a plurality of bumps. 
     
     
         9 . The heat dissipating pad of  claim 5 , wherein the first main rib and the second main rib have peaks, respectively, whereas the first auxiliary ribs and the second auxiliary ribs have peaks, respectively, wherein the peaks of the first and second main ribs are higher than the peaks of the first and second auxiliary ribs so as to support the electronic device. 
     
     
         10 . A heat dissipating bag for removing heat generated from an electronic device and containing the electronic device, the heat dissipating bag comprising:
 a first heat dissipating pad comprising a first substrate and a first heat dissipating layer disposed on the first substrate, the first heat dissipating layer comprising a first main rib and a plurality of first auxiliary ribs, wherein a plurality of first heat dissipating grooves is formed between the first main rib and the first auxiliary ribs, wherein the first main rib and the first auxiliary ribs are half-wave shaped and periodically protrude from the first substrate; and   a second heat dissipating pad comprising a second substrate and a second heat dissipating layer disposed on the second substrate, the second heat dissipating layer comprising a second main rib and a plurality of second auxiliary ribs, wherein a plurality of second heat dissipating grooves is formed between the second main rib and the second auxiliary ribs, wherein the second main rib and the second auxiliary ribs are half-wave shaped and periodically protrude from the second substrate;   wherein the first heat dissipating pad and the second heat dissipating pad are coupled together to form a receiving space for receiving the electronic device, such that heat generated by the electronic device is dissipated by at least one of the first heat dissipating grooves and the second heat dissipating grooves.   
     
     
         11 . The heat dissipating bag of  claim 10 , wherein a space width spacing apart the first main rib and each of the first auxiliary ribs determines a first ratio, wherein a space width spacing apart the second main rib and each of the second auxiliary ribs determines a second ratio. 
     
     
         12 . The heat dissipating bag of  claim 11 , wherein a mathematical relation expressing a relationship between the space width and the first ratio and expressing a relationship between the space width and the second ratio is as follows:
     R =|(1 −B×SPW/D )|   wherein the first ratio and the second ratio are denoted by R, a constant by B, and the space width by SPW, wherein a distance between the first main rib and a nearest one of the first auxiliary ribs thereto and a distance between the second main rib to a nearest one of the second auxiliary ribs thereto are denoted by D.   
     
     
         13 . The heat dissipating bag of  claim 10 , further comprising an anti-slip layer disposed on a side of the first heat dissipating pad and on a side of the second heat dissipating pad, wherein the anti-slip layer-disposed side of the first heat dissipating pad does not bear the first heat dissipating layer, wherein the anti-slip layer-disposed side of the second heat dissipating pad does not bear the second heat dissipating layer.