US2013333331A1PendingUtilityA1
Method of packing edibles
Est. expiryMar 21, 2031(~4.7 yrs left)· nominal 20-yr term from priority
Inventors:Mukul Chandra Gope
B65B 51/02
15
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Claims
Abstract
This invention relates to the use of a non-hygroscopic adhesive in packing and an improved method of packing edibles using non-hygroscopic adhesive which is applied on the entire length of both the margins of the packaging material till the end, wherein the breadth of the adhesive is usually around 1 cm. The edibles are wrapped by closely apposing the margins without any open surface. For additional safety, a paper packing of the edible can be made first before final packaging.
Claims
exact text as granted — not AI-modified1 . An improved method of packaging moisture vulnerable powdered ( 0002 . 5 ), and solid ( 0002 . 8 ) edibles of longer shelf life ( 0023 . 1 ), subjected to environmental temperature ( 0017 . 4 ), and humidity ( 0002 . 3 and 0027 . 2 ) variations over weeks to months ( 0023 . 1 ) during handling, transport and storage ( 0017 . 2 ); using the available non-hygroscopic adhesives ( 0005 . 1 ), to counter the explained drawbacks of conventionally used hygroscopic adhesives ( 0017 . 1 and 0025 . 1 and FIGS. 1-8 ) at present, for packaging powdered and solid edibles, exposed to similar environmental conditions; wherein with the possibility numerous alterations and modifications by those skilled in the art ( 0028 ), the non-hygroscopic adhesive is applied on the entire length of both the margins of the packaging material till the end, ensuring the breadth of the adhesive around 1 cm, the edibles are wrapped by closely apposing the margins without any open surface ( 0026 . 1 - 0026 . 3 and FIG. 8 ).
2 . The method of claim 1 , in which non-hydroscopic adhesive are used for packaging powdered and solid edibles, those are handled, transported and stored over weeks/months under normal environmental conditions.
3 . The method of claim 1 , which improves shelf life of the packaged edible, those are exposed to environmental temperature and humidity variations, owing to absence of moisture absorbing nature of non-hygroscopic adhesive.
4 . The method of claim 1 , which removes the risk of food spoilage due to microorganisms or chemical reactions that would occur, when hygroscopic adhesives are used.
5 . The method of claim 1 , which concerns health benefit to the consumer by ensuring safety of the packaged edible.
6 . The method of claim 1 , which is capable of addressing and overcoming the abovementioned disadvantages of hygroscopic adhesives.Join the waitlist — get patent alerts
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