RF Power Conversion to DC Power with a Leaky Wave Antenna
Abstract
Methods and systems for converting RF power to DC power utilizing a leaky wave antenna (LWA) are disclosed and may include receiving RF wireless signals utilizing one or more LWAs in a wireless device, and generating one or more DC voltages from the received RF signals utilizing cascaded rectifier cells. A resonant frequency of the LWAs may be configured utilizing micro-electro-mechanical systems (MEMS) deflection. The LWAs may be configured to receive the RF signals from a desired direction. The LWAs may comprise microstrip or coplanar waveguides, wherein a cavity height of the LWAs is dependent on a spacing between conductive lines in the waveguides. The LWAs may be integrated in one or more integrated circuits, integrated circuit packages, and/or printed circuit boards. The packages may be affixed to one or more printed circuit boards and the integrated circuits may be flip-chip-bonded to the packages.
Claims
exact text as granted — not AI-modified1 - 20 . (canceled)
21 . A wireless device comprising:
one or more leaky wave antennas, wherein said wireless device is operable to: receive RF signals utilizing said one or more leaky wave antennas, and generate one or more DC voltages from said RF signals.
22 . The wireless device of claim 21 , wherein said wireless device is operable to configure a resonant frequency of said one or more leaky wave antennas utilizing micro-electro-mechanical systems (MEMS).
23 . The wireless device of claim 21 , wherein said wireless device is operable to configure said one or more leaky wave antennas to receive said RF signals from a desired direction.
24 . The wireless device of claim 21 , wherein said one or more leaky wave antennas comprise microstrip waveguides.
25 . The wireless device of claim 24 , wherein a cavity height of said one or more leaky wave antennas is dependent on a spacing between conductive lines in said microstrip waveguides.
26 . The wireless device of claim 21 , wherein said one or more leaky wave antennas comprise coplanar waveguides.
27 . The wireless device of claim 26 , wherein a cavity height of said one or more leaky wave antennas is dependent on a spacing between conductive lines in said coplanar waveguides.
28 . The wireless device of claim 21 , wherein said one or more leaky wave antennas are integrated in one or more flip-chips.
29 . The wireless device of claim 28 , wherein said one or more flip-chips are bonded to one or more integrated circuit packages.
30 . The wireless device of claim 21 , wherein said one or more leaky wave antennas are integrated in one or more integrated circuit packages affixed to one or more printed circuit boards.
31 . The wireless device of claim 21 , wherein said one or more leaky wave antennas are integrated in one or more printed circuit boards.
32 . A method for wireless communication, said method comprising:
receiving RF signals utilizing one or more leaky wave antennas in a wireless device; generating one or more DC voltages from said RF signals.
33 . The method of claim 32 , comprising configuring a resonant frequency of said one or more leaky wave antennas utilizing micro-electro-mechanical systems (MEMS).
34 . The method of claim 32 , comprising configuring said one or more leaky wave antennas to receive said RF signals from a desired direction.
35 . The method of claim 32 , wherein said one or more leaky wave antennas comprise microstrip waveguides.
36 . The method of claim 35 , wherein a cavity height of said one or more leaky wave antennas is dependent on a spacing between conductive lines in said microstrip waveguides.
37 . The method of claim 32 , wherein said one or more leaky wave antennas comprise coplanar waveguides.
38 . The method of claim 37 , wherein a cavity height of said one or more leaky wave antennas is dependent on a spacing between conductive lines in said coplanar waveguides.
39 . The method of claim 32 , wherein said one or more leaky wave antennas are integrated in one or more flip-chips.
40 . The method of claim 32 , wherein said one or more leaky wave antennas are integrated in one or more printed circuit boards.Join the waitlist — get patent alerts
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