US2013328739A1PendingUtilityA1

RF Power Conversion to DC Power with a Leaky Wave Antenna

Assignee: BROADCOM CORPPriority: Jun 9, 2009Filed: Aug 9, 2013Published: Dec 12, 2013
Est. expiryJun 9, 2029(~2.9 yrs left)· nominal 20-yr term from priority
H01Q 13/22H01Q 13/20B81B 7/02H10W 90/734H10W 90/724H10W 74/15H10W 44/248H10W 44/216H01Q 1/248
53
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Claims

Abstract

Methods and systems for converting RF power to DC power utilizing a leaky wave antenna (LWA) are disclosed and may include receiving RF wireless signals utilizing one or more LWAs in a wireless device, and generating one or more DC voltages from the received RF signals utilizing cascaded rectifier cells. A resonant frequency of the LWAs may be configured utilizing micro-electro-mechanical systems (MEMS) deflection. The LWAs may be configured to receive the RF signals from a desired direction. The LWAs may comprise microstrip or coplanar waveguides, wherein a cavity height of the LWAs is dependent on a spacing between conductive lines in the waveguides. The LWAs may be integrated in one or more integrated circuits, integrated circuit packages, and/or printed circuit boards. The packages may be affixed to one or more printed circuit boards and the integrated circuits may be flip-chip-bonded to the packages.

Claims

exact text as granted — not AI-modified
1 - 20 . (canceled) 
     
     
         21 . A wireless device comprising:
 one or more leaky wave antennas, wherein said wireless device is operable to:   receive RF signals utilizing said one or more leaky wave antennas, and   generate one or more DC voltages from said RF signals.   
     
     
         22 . The wireless device of  claim 21 , wherein said wireless device is operable to configure a resonant frequency of said one or more leaky wave antennas utilizing micro-electro-mechanical systems (MEMS). 
     
     
         23 . The wireless device of  claim 21 , wherein said wireless device is operable to configure said one or more leaky wave antennas to receive said RF signals from a desired direction. 
     
     
         24 . The wireless device of  claim 21 , wherein said one or more leaky wave antennas comprise microstrip waveguides. 
     
     
         25 . The wireless device of  claim 24 , wherein a cavity height of said one or more leaky wave antennas is dependent on a spacing between conductive lines in said microstrip waveguides. 
     
     
         26 . The wireless device of  claim 21 , wherein said one or more leaky wave antennas comprise coplanar waveguides. 
     
     
         27 . The wireless device of  claim 26 , wherein a cavity height of said one or more leaky wave antennas is dependent on a spacing between conductive lines in said coplanar waveguides. 
     
     
         28 . The wireless device of  claim 21 , wherein said one or more leaky wave antennas are integrated in one or more flip-chips. 
     
     
         29 . The wireless device of  claim 28 , wherein said one or more flip-chips are bonded to one or more integrated circuit packages. 
     
     
         30 . The wireless device of  claim 21 , wherein said one or more leaky wave antennas are integrated in one or more integrated circuit packages affixed to one or more printed circuit boards. 
     
     
         31 . The wireless device of  claim 21 , wherein said one or more leaky wave antennas are integrated in one or more printed circuit boards. 
     
     
         32 . A method for wireless communication, said method comprising:
 receiving RF signals utilizing one or more leaky wave antennas in a wireless device;   generating one or more DC voltages from said RF signals.   
     
     
         33 . The method of  claim 32 , comprising configuring a resonant frequency of said one or more leaky wave antennas utilizing micro-electro-mechanical systems (MEMS). 
     
     
         34 . The method of  claim 32 , comprising configuring said one or more leaky wave antennas to receive said RF signals from a desired direction. 
     
     
         35 . The method of  claim 32 , wherein said one or more leaky wave antennas comprise microstrip waveguides. 
     
     
         36 . The method of  claim 35 , wherein a cavity height of said one or more leaky wave antennas is dependent on a spacing between conductive lines in said microstrip waveguides. 
     
     
         37 . The method of  claim 32 , wherein said one or more leaky wave antennas comprise coplanar waveguides. 
     
     
         38 . The method of  claim 37 , wherein a cavity height of said one or more leaky wave antennas is dependent on a spacing between conductive lines in said coplanar waveguides. 
     
     
         39 . The method of  claim 32 , wherein said one or more leaky wave antennas are integrated in one or more flip-chips. 
     
     
         40 . The method of  claim 32 , wherein said one or more leaky wave antennas are integrated in one or more printed circuit boards.

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