Device and Method for Monitoring a Laser Cutting Process

Abstract

The present disclosure relates to a device for monitoring and for controlling a laser cutting process on a workpiece, and a method of using the same. The device includes an image capturing apparatus for capturing an image of a region of the workpiece to be monitored, in which the region of the workpiece to be monitored includes a region of interaction of a laser beam with the workpiece, and an evaluation apparatus for detecting material boundaries of the workpiece using the captured image. The evaluation apparatus is configured to determine at least one characteristic value of the laser cutting process based on a geometric relationship between at least two of the detected material boundaries, the region of interaction, or combinations thereof.

What is claimed is: 
     
         1 .- 19 . (canceled) 
     
     
         20 . A device for monitoring and for controlling a laser cutting process on a workpiece, the device comprising:
 an image capturing apparatus for capturing an image of a region of the workpiece to be monitored, and   an evaluation apparatus for detecting material boundaries of the workpiece using the captured image, the material boundaries including edges of a first gap formed during the laser cutting process,   wherein the evaluation apparatus is configured to determine at least one characteristic value of the laser cutting process based on a geometric relationship between at least two detected material boundaries, the characteristic value including a first gap center of the first gap cut in the workpiece.   
     
     
         21 . The device according to  claim 20 , wherein the characteristic value includes a second gap center in a second gap cut in the workpiece, wherein the second gap center does not run parallel to the first cut gap, and wherein the evaluation apparatus is configured to determine a tool center point of the laser cutting process in a plane parallel to the workpiece based on the first and second gap centers. 
     
     
         22 . The device according to  claim 21 , wherein the evaluation apparatus is configured to determine a geometric relationship between the tool center point and at least one detected material boundary, the device further comprising a control apparatus configured to switch a laser beam on or off as a function of the determined geometric relationship. 
     
     
         23 . The device according to  claim 21 , wherein the evaluation apparatus is configured to determine a geometric relationship between the tool center point and a gap center of a further gap cut in the workpiece in a previous laser cutting process, and wherein the control apparatus is configured to switch the laser beam on or off when the gap center of the further gap cut is reached by the tool center point. 
     
     
         24 . The device according to  claim 22 , wherein the evaluation apparatus is configured to determine a geometric relationship between the tool center point and at least one detected edge of the workpiece, and wherein the control apparatus is configured to switch the laser beam on or off when the at least one detected edge is reached by the tool center point. 
     
     
         25 . The device according to  claim 20 , wherein the region of the workpiece to be monitored comprises a region of interaction of a laser beam with the workpiece.