Laminated chip electronic component, board for mounting the same, and packing unit thereof

Abstract

A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; first and second external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer; and additional electrode layers disposed irrespective of a formation of capacitance within the lower cover layer.

1 .- 13 . (canceled) 
     
     
         14 . A laminated chip electronic component comprising:
 external electrodes formed on both end portions of a ceramic body having a hexahedral shape in a length direction;   an active layer formed within the ceramic body and including a plurality of internal electrodes disposed to face each other, while having dielectric layers interposed therebetween to form capacitance;   an upper cover layer formed on an upper portion of the uppermost internal electrode of the active layer;   a lower cover layer formed on a lower portion of the lowermost internal electrode of the active layer and having a thickness greater than that of the upper cover layer; and   additional electrode layers disposed irrespective of a formation of capacitance within the lower cover layer.   
     
     
         15 . The laminated chip electronic component of  claim 14 , wherein due to a difference between strain generated in a central portion of the active layer and that generated in the lower cover layer as a voltage is applied, a point of inflection (PI) is formed at both end portions of the ceramic body in the length direction, which are lower than the central portion of the ceramic body in the thickness direction. 
     
     
         16 - 24 . (canceled) 
     
     
         25 . A board for mounting a laminated chip electronic component, comprising:
 a laminated chip electronic component of  claim 14 ;   electrode pads electrically connected to the external electrodes through soldering; and   a printed circuit board (PCB) on which the electrode pads are formed and the laminated chip electronic component is mounted on the electrode pads such that the internal electrodes are horizontal and the lower cover layer is disposed in a lower position than the upper cover layer in a thickness direction.   
     
     
         26 . A packing unit comprising:
 a laminated chip electronic component of  claim 14 ; and   a packing sheet including a receiving portion for receiving the laminated chip electronic component,   wherein the internal electrodes are disposed to be aligned horizontally based on a lower surface of the receiving portion.