US2013319640A1PendingUtilityA1

Methods, apparatuses, and systems for thermal management between devices

Assignee: MOTOROLA MOBILITY LLCPriority: Jun 4, 2012Filed: Jan 16, 2013Published: Dec 5, 2013
Est. expiryJun 4, 2032(~5.9 yrs left)· nominal 20-yr term from priority
H04M 1/72412H04M 1/72409H04B 1/3877G06F 1/1632G06F 1/206G06F 1/203F28F 7/00
44
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Claims

Abstract

A peripheral electronic device ( 106 ) can be equipped with a coupler, which in one embodiment is a thermal transference coupler ( 136 ). The thermal transference coupler ( 136 ) can include a thermally conductive surface ( 402 ) configured to draw heat from a major face ( 301 ) of another electronic device disposed within the coupler that abuts the thermally conductive surface ( 402 ).

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An electronic device, comprising:
 an electronic device including a thermal transference coupler comprising a thermally conductive surface, the thermal transference coupler configured to:
 receive another electronic device such that a major face of the another electronic device abuts the thermally conductive surface; and 
   draw heat from the another electronic device to the thermally conductive surface when the another electronic device is disposed within the thermal transference coupler and is operable.   
     
     
         2 . The electronic device of  claim 1 , the electronic device further comprising an interface configured for data communication with a control circuit of the another electronic device. 
     
     
         3 . The electronic device of  claim 2 , wherein the interface is wireless. 
     
     
         4 . The electronic device of  claim 1 , wherein the electronic device comprises a display module thermally coupled with the thermally conductive surface, the display module being operable as a heat sink for the thermally conductive surface. 
     
     
         5 . The electronic device of  claim 1 , wherein the another electronic device comprises: a printed circuit board; a battery; and a display, wherein the printed circuit board is proximally disposed with the major face. 
     
     
         6 . The electronic device of  claim 5 , wherein the battery is disposed between the printed circuit board and the display. 
     
     
         7 . The electronic device of  claim 5 , wherein the display is operable when the electronic device is disposed within the thermal transference coupler to provide a secondary display function. 
     
     
         8 . The electronic device of  claim 5 , wherein:
 the another electronic device comprises one or more processors; and   the electronic device comprises an interface configured for data communication with the another electronic device when disposed within the thermal transference coupler.   
     
     
         9 . An electronic device, comprising:
 an electronic device and an another electronic device; and   the electronic device including a thermal transference coupler comprising a thermally conductive surface, the thermal transference coupler configured to: receive the another electronic device such that a major face of the another electronic device abuts the thermally conductive surface; and draw heat from the another electronic device to the thermally conductive surface when the another electronic device is disposed within the thermal transference coupler and is operable.   
     
     
         10 . The electronic device of  claim 9 , wherein the another electronic device comprises: a printed circuit board; a battery; and a display, wherein the printed circuit board is proximally disposed with the major face. 
     
     
         11 . The electronic device of  claim 10 , wherein the battery is disposed between the printed circuit board and the display. 
     
     
         12 . The electronic device of  claim 10 , wherein the display is operable when the electronic device is disposed within the thermal transference coupler to provide a secondary display function. 
     
     
         13 . The electronic device of  claim 9 , wherein the thermally conductive surface is connected to a heat pipe. 
     
     
         14 . The electronic device of  claim 9 , wherein the thermally conductive surface is thermally connected to a heat pipe and a heat spreader. 
     
     
         15 . The electronic device of  claim 9 , wherein the thermal transference coupler includes a blower. 
     
     
         16 . The electronic device of  claim 9 , the electronic device includes a controller, heat sensor and blower. 
     
     
         17 . An electronic device, comprising:
 an electronic device;   a coupler configured to receive another electronic device; and   an interface configured for data communication with the another electronic device when disposed within the coupler.   
     
     
         18 . The electronic system of  claim 9 , wherein:
 the coupler comprises a thermal transference coupler having a thermally conductive surface; and   a major face of the first electronic device is configured to abut the thermally conductive surface and sink heat from the first electronic device to the thermally conductive surface when the first electronic device is disposed within the thermal transference coupler.

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