Tool for use with dual-sided chemical mechanical planarization pad conditioner

Abstract

A tool includes a holder configured to couple to a dual-sided chemical mechanical planarization (CMP) pad conditioner. The holder has a magnetic material, a first magnetic field strength (H 1 ) at a first face, and a second magnetic field strength (H 2 ) at a second face opposite the first face. The first magnetic field strength (H 1 ) is different than the second magnetic field strength (H 2 ).

1 . A tool comprising:
 a holder configured to couple to a dual-sided chemical mechanical planarization (CMP) pad conditioner, the holder comprising a magnetic material, wherein the holder comprises a first magnetic field strength (H 1 ) at a first face, a second magnetic field strength (H 2 ) at a second face opposite the first face, and the first magnetic field strength (H 1 ) is different than the second magnetic field strength (H 2 ).   
     
     
         2 . The tool of  claim 1 , wherein the first magnetic field strength (H 1 ) is greater than the second magnetic field strength (H 2 ), wherein the first magnetic field strength (H 1 ) is less than the second magnetic field strength (H 2 ), wherein the first magnetic field strength and the second magnetic field strength define a ratio (H 1 :H 2 ) of at least about 1.1:1, at least about 2:1, or at least about 5:1 
     
     
         3 . The tool of  claim 1 , wherein the holder comprises a material having an elastic modulus of at least about 2E3 MPa, wherein the holder comprises a material selected from the group of materials consisting of metals, metal alloys, polymers, ceramics, and a combination thereof. 
     
     
         4 . The tool of  claim 1 , further comprising a dual-sided CMP pad conditioner coupled to the holder, wherein the dual-sided CMP pad conditioner comprises a substrate having a first major surface and a second major surface opposite the first major surface, wherein the substrate comprises a solid material, wherein the substrate has a porosity of less than about 5 vol % for a total volume of the substrate, wherein the substrate comprises a depression configured for complementary engagement with the holder, wherein the substrate comprises a sealing member, wherein the sealing member is coupled to a side surface of the substrate, wherein the side surface extends between the first and second major surfaces, wherein the sealing member extends in a peripheral direction along at least a portion of the side surface of the substrate. 
     
     
         5 . The tool of  claim 4 , wherein the dual-sided CMP pad conditioner comprises a first single layer of abrasive grains attached to the first major surface of the substrate, further comprising a first bonding layer overlying the first major surface, wherein the first single layer of abrasive grains are contained within the first bonding layer, further comprising a second single layer of abrasive grains attached to the second major surface of the substrate, further comprising a second bonding layer overlying the second major surface, wherein the second single layer of abrasive grains are contained within the second bonding layer, wherein the first single layer of abrasive grains and second single layer of abrasive grains are configured to be spaced apart from the holder. 
     
     
         6 . The abrasive tool of  claim 5 , wherein the abrasive grains of the first single layer comprise superabrasive grains, wherein the abrasive grains of the first single layer comprise a material selected from the group consisting of diamond, carbon, silicon carbide, alumina, silica, cubic boron nitride, and a combination thereof, wherein the abrasive grains of the first single layer of abrasive grains are different than the abrasive grains of the second single layer of abrasive grains, wherein the abrasive grains of the first single layer have an average grit size that is less than about 300 microns, wherein the abrasive grains of the second single layer of abrasive grains have a same average grit size of the abrasive grains of the first single layer. 
     
     
         7 . The tool of  claim 1 , further comprising a dual-sided CMP pad conditioner, and the holder and dual-sided CMP pad conditioner are removably coupled such that the dual-sided CMP pad conditioner has reversible orientations relative to the holder. 
     
     
         8 . The tool of  claim 1 , wherein the dual-sided CMP pad conditioner comprises a substrate having an engagement structure configured for engagement with the holder, wherein the holder comprises a recess configured for complementary engagement with the dual-sided CMP pad conditioner. 
     
     
         9 . The tool of  claim 1 , wherein the magnetic material comprises at least one of a ferromagnetic material and a paramagnetic material, wherein the magnetic material comprises a material selected from the group consisting of metals, metal alloys, natural materials, transition metal elements, rare earth elements, oxides, ferrites, polymers, and a combination thereof. 
     
     
         10 . The tool of  claim 1 , wherein the magnetic material comprises a permanent magnet, wherein the magnetic material comprises an electromagnet, wherein the magnetic material is configured for selective operation between a first state and a second state for selective coupling with and decoupling from, respectively, the dual-sided CMP pad conditioner. 
     
     
         11 . The tool of  claim 10 , wherein the first state comprises a first magnetic field strength, and the second state comprises a second magnetic field strength. 
     
     
         12 . The tool of  claim 10 , wherein the first state comprises a first magnetic pole orientation, and the second state comprises a second magnetic pole orientation. 
     
     
         13 . The tool of  claim 1 , wherein the substrate comprises a substrate magnetic material, wherein the substrate magnetic material comprises a permanent magnet, wherein the substrate magnetic material comprises an electromagnet, wherein the substrate magnetic material is configured for selective operation between a first state and a second state for selective coupling with and decoupling from, respectively, the holder. 
     
     
         14 . The tool of  claim 13 , wherein the first state comprises a first magnetic field strength, and the second state comprises a second magnetic field strength. 
     
     
         15 . The tool of  claim 13 , wherein the first state comprises a first magnetic pole orientation, and the second state comprises a second magnetic pole orientation. 
     
     
         16 . The tool of  claim 1 , wherein a majority of the holder is the magnetic material, wherein the entire holder consists essentially of the magnetic material. 
     
     
         17 . The tool of  claim 1 , wherein the magnetic material is a magnetic object that is separate from the holder, wherein the magnetic object is contained within an interior volume of the holder, wherein the magnetic object intersects with the first face of the holder, wherein the magnetic object intersects with the second face of the holder, wherein the magnetic object is contained in an internal cavity within the holder that is seamless with the first face of the holder, wherein the magnetic object is contained in an internal cavity within the holder that is seamless with the second face of the holder, wherein the magnetic object comprises a two-dimensional cross-sectional shape selected from the group consisting of an annulus, circle, ellipse, polygonal, irregular, and a combination thereof, wherein the magnetic object comprises a plurality of magnetic objects, wherein the plurality of magnetic objects are arranged in a pattern relative to each other. 
     
     
         18 . A tool comprising:
 a holder having a first face configured to couple to a dual-sided chemical mechanical planarization (CMP) pad conditioner, a second face opposite the first face, an internal cavity located inside the holder, the second face is seamless with respect to the internal cavity, and the internal cavity contains a magnetic material.   
     
     
         19 . The tool of  claim 18 , wherein the internal cavity is permanently sealed with a cap that is welded to the holder adjacent the second face. 
     
     
         20 . The tool of  claim 19 , wherein the second face is polished such that the cap and second face are flush and seamless. 
     
     
         21 . The tool of  claim 19 , wherein the holder and cap are formed from a same material, wherein the holder and cap are formed from different materials. 
     
     
         22 . The tool of  claim 19 , wherein the second face has a selected surface roughness, wherein the second face is essentially free of macroscopic grooves and protrusions. 
     
     
         23 . A tool comprising:
 a holder configured to couple to a dual-sided chemical mechanical planarization (CMP) pad conditioner, and the holder comprises a magnetic material configured for selective operation between a first state and a second state for selective coupling with and decoupling from, respectively, the dual-sided CMP pad conditioner.   
     
     
         24 . The tool of  claim 23 , wherein the first state comprises a first magnetic field strength, and the second state comprises a second magnetic field strength. 
     
     
         25 . The tool of  claim 23 , wherein the first state comprises a first magnetic pole orientation, and the second state comprises a second magnetic pole orientation. 
     
     
         26 - 42 . (canceled)