Printed circuit board and manufacturing method thereof

Abstract

A printed circuit board and a manufacturing method of the same are disclosed. The method includes: preparing a carrier including a primer resin layer formed thereon; forming a circuit pattern on the primer resin layer; stacking the carrier onto an insulating layer such that the circuit pattern is buried in the insulating layer; removing the carrier; forming a via hole in the insulating layer on which the primer resin layer is stacked; and forming a conductive via in the via hole. The conductive via is formed by forming a plating layer in the via hole and on the primer resin layer and removing a portion of the plating layer formed over the primer resin layer.

1 . A method of manufacturing a printed circuit board, the method comprising:
 preparing a carrier including a primer resin layer formed thereon;   forming a circuit pattern on the primer resin layer;   stacking the carrier onto an insulating layer such that the circuit pattern is buried in the insulating layer;   removing the carrier;   forming a via hole in the insulating layer, the primer resin layer being stacked on the insulating layer; and   forming a conductive via in the via hole by forming a plating layer in the via hole and on the primer resin layer and removing a portion of the plating layer formed over the primer resin layer.   
     
     
         2 . The method of  claim 1 , wherein the carrier is made of metal. 
     
     
         3 . The method of  claim 1 , wherein the forming of a via hole comprises performing a laser processing from a direction of the primer resin layer. 
     
     
         4 . The method of  claim 3 , wherein the via hole is a blind via hole (BVH). 
     
     
         5 - 6 . (canceled)