Touch panel with single plate and manufacturing method thereof

Abstract

A touch panel with a single plate includes a plate and a sensing circuit structure. The substrate is taken as a cover. The sensing circuit structure is formed on the plate.

What is claimed is: 
     
         1 . A touch panel with a single plate comprising:
 a substrate, taken as a cover;   a sensing circuit structure, formed on the substrate and having a shielding function; and   a shielding structure, formed on the substrate.   
     
     
         2 . The touch panel of  claim 1 , wherein the sensing circuit structure comprises:
 a transparent conductive layer, formed on the substrate;   a conductive decorative pad, formed on the transparent conductive layer;   a decorative layer, formed on the transparent conductive layer and the conductive decorative pad, and having an opening on the conductive decorative pad; and   a non-transparent conductive layer, formed on the decorative layer, and electrically connected with the transparent conductive layer via the opening.   
     
     
         3 . The touch panel of  claim 2 , wherein the conductive decorative pad completely covers the opening, a conductive capacity of the conductive decorative pad is superior to a conductive capacity of the decorative layer, and a color of the conductive decorative pad is substantially the same with a color of the decorative layer. 
     
     
         4 . The touch panel of  claim 2 , wherein a material of the conductive decorative pad comprises carbon, nano copper, nano silver, or conductive polymer resin, and a material of the decorative layer comprises various color inks with insulation. 
     
     
         5 . The touch panel of  claim 2 , wherein a part of the non-transparent conductive layer is formed on the opening, and a material of the non-transparent conductive layer comprises a metal material or a radiation-curable conductive material. 
     
     
         6 . The touch panel of  claim 5 , wherein the non-transparent conductive layer is formed by utilizing a radiation to irradiate the radiation-curable conductive material for curing a part of the radiation-curable conductive material and removing an incurable radiation-curable conductive material. 
     
     
         7 . The touch panel of  claim 6 , wherein a curable part of the radiation-curable conductive material is made by setting a mask on the radiation-curable conductive material to selectively cure the radiation-curable conductive material. 
     
     
         8 . The touch panel of  claim 2 , wherein the sensing circuit structure further comprises:
 a conductive filler, formed on the opening.   
     
     
         9 . The touch panel of  claim 2 , wherein the transparent conductive layer comprises a plurality of first transparent conductive units and a plurality of second transparent conductive units, the plurality of first transparent conductive units and the plurality of second transparent conductive units are formed on a same side of the substrate, and the plurality of first transparent conductive units and the plurality of second transparent conductive units respectively have an extending direction perpendicular to each other. 
     
     
         10 . The touch panel of  claim 9 , wherein the transparent conductive layer further comprises an insulation part formed between the plurality of first transparent conductive units and the plurality of second transparent conductive units. 
     
     
         11 . The touch panel of  claim 1 , wherein the sensing circuit structure comprises:
 a transparent conductive layer, formed on the substrate;   a shielding decorative layer, formed on the substrate and the transparent conductive layer;   a transparent conductive connection layer, formed on the transparent conductive layer and the shielding decorative layer, extended from the transparent conductive layer toward the shielding decorative layer, and exceeding an edge of the transparent conductive layer; and   a non-transparent conductive layer, formed on the shielding decorative layer and the transparent conductive connection layer, and not formed on the transparent conductive layer.   
     
     
         12 . The touch panel of  claim 11 , wherein the non-transparent conductive layer formed on the shielding decorative layer is extended toward the transparent conductive layer and doest not exceed the edge of the transparent conductive layer. 
     
     
         13 . The touch panel of  claim 11 , wherein a material of the shielding decorative layer comprises various color inks with insulation, a material of the transparent conductive layer comprises conductive polymer resin or indium tin oxide, and a material of the non-transparent conductive layer comprises silver glue, copper, molybdenum, or aluminum. 
     
     
         14 . The touch panel of  claim 11 , wherein the shielding decorative layer has an opening on the transparent conductive layer, the transparent conductive connection layer is filled into the opening, and the sensing circuit structure further comprise:
 another shielding decorative layer, formed on the transparent conductive layer to cover the opening.   
     
     
         15 . The touch panel of  claim 11 , wherein a material of the non-transparent conductive layer comprises a metal material or a radiation-curable conductive material. 
     
     
         16 . The touch panel of  claim 15 , wherein the non-transparent conductive layer is formed by utilizing a radiation to irradiate the radiation-curable conductive material for curing a part of the radiation-curable conductive material and removing an incurable radiation-curable conductive material. 
     
     
         17 . The touch panel of  claim 16 , wherein a curable part of the radiation-curable conductive material is made by setting a mask on the radiation-curable conductive material to selectively cure the radiation-curable conductive material. 
     
     
         18 . The touch panel of  claim 11 , wherein the transparent conductive layer comprises a plurality of first transparent conductive units and a plurality of second transparent conductive units, the plurality of first transparent conductive units and the plurality of second transparent conductive units are formed on a same side of the substrate, and the plurality of first transparent conductive units and the plurality of second transparent conductive units respectively have an extending direction perpendicular to each other. 
     
     
         19 . The touch panel of  claim 18 , wherein the transparent conductive layer further comprises an insulation part formed between the plurality of first transparent conductive units and the plurality of second transparent conductive units. 
     
     
         20 . The touch panel of  claim 1 , wherein the sensing circuit structure comprises a transparent conductive layer and a touch sensing circuit is defined in the transparent conductive layer. 
     
     
         21 . The touch panel of  claim 1 , wherein the sensing circuit structure further comprises:
 a pin; and   a conductive bonding object, bonding the pin and the non-transparent conductive layer.   
     
     
         22 . The touch panel of  claim 1 , wherein the sensing circuit structure comprises:
 a pin; and   a conductive bonding object, formed on the substrate, bonding the pin and the substrate, and electrically connecting the pin and the transparent conductive layer.   
     
     
         23 . A touch panel with a single plate comprising:
 a substrate, taken as a cover; and   a sensing circuit structure, formed on the substrate and having a shielding function.   
     
     
         24 . The touch panel of  claim 23 , wherein the sensing circuit structure comprises:
 a transparent conductive layer, formed on the substrate;   a conductive decorative pad, formed on the transparent conductive layer;   a decorative layer, formed on the transparent conductive layer and the conductive decorative pad, and having an opening on the conductive decorative pad; and   a non-transparent conductive layer, formed on the decorative layer, and electrically connected with the transparent conductive layer via the opening.   
     
     
         25 . The touch panel of  claim 23 , wherein the sensing circuit structure comprises:
 a transparent conductive layer, formed on the substrate;   a shielding decorative layer, formed on the substrate and the transparent conductive layer;   a transparent conductive connection layer, formed on the transparent conductive layer and the shielding decorative layer, extended from the transparent conductive layer toward the shielding decorative layer, and exceeding an edge of the transparent conductive layer; and   a non-transparent conductive layer, formed on the shielding decorative layer and the transparent conductive connection layer, and not formed on the transparent conductive layer.   
     
     
         26 . A manufacturing method of a touch panel with a single plate, comprising:
 forming a sensing circuit structure having a shielding function on a substrate;   forming a shielding structure on a substrate; and   taking the substrate as a cover.   
     
     
         27 . The manufacturing method of  claim 26 , wherein the step of forming the sensing circuit structure comprises:
 forming a transparent conductive layer on the substrate;   forming a conductive decorative pad on the transparent conductive layer;   forming a decorative layer on the conductive decorative pad, wherein the decorative layer has an opening on the conductive decorative pad; and   forming a non-transparent conductive layer on the decorative layer, wherein the non-transparent conductive layer is electrically connected with the transparent conductive layer via the opening.   
     
     
         28 . The manufacturing method of  claim 27 , wherein the non-transparent conductive layer is formed by utilizing a radiation to irradiate the radiation-curable conductive material for curing a part of the radiation-curable conductive material and removing an incurable radiation-curable conductive material. 
     
     
         29 . The manufacturing method of  claim 28 , wherein a curable part of the radiation-curable conductive material is made by setting a mask on the radiation-curable conductive material to selectively cure the radiation-curable conductive material. 
     
     
         30 . The manufacturing method of  claim 27 , wherein the step of forming the sensing circuit structure further comprises:
 forming a conductive bonding object on the substrate; and   bonding the pin and the substrate by the conductive bonding object, and electrically connecting the pin and the transparent conductive layer by the conductive bonding object.   
     
     
         31 . The manufacturing method of  claim 26 , wherein the step of forming the sensing circuit structure comprises:
 forming a transparent conductive layer on the substrate;   forming a shielding decorative layer on the substrate and the transparent conductive layer;   forming a transparent conductive connection layer on the transparent conductive layer and the shielding decorative layer, wherein the transparent conductive connection layer is extended from the transparent conductive layer toward the shielding decorative layer and exceeds an edge of the transparent conductive layer; and   forming a non-transparent conductive layer on the shielding decorative layer and the transparent conductive connection layer, wherein the non-transparent conductive layer is not formed on the transparent conductive layer.   
     
     
         32 . The manufacturing method of  claim 31 , wherein the shielding decorative layer has an opening on the transparent conductive layer, the transparent conductive connection layer is filled into the opening, and the step of forming the sensing circuit structure further comprises:
 forming another shielding decorative layer on the transparent conductive layer to cover the opening.   
     
     
         33 . The manufacturing method of  claim 31 , wherein the non-transparent conductive layer is formed by utilizing a radiation to irradiate the radiation-curable conductive material for curing a part of the radiation-curable conductive material and removing an incurable radiation-curable conductive material. 
     
     
         34 . The manufacturing method of  claim 33 , wherein a curable part of the radiation-curable conductive material is made by setting a mask on the radiation-curable conductive material to selectively cure the radiation-curable conductive material. 
     
     
         35 . The manufacturing method of  claim 31 , wherein the step of forming the sensing circuit structure further comprises:
 forming a conductive bonding object on the substrate; and   bonding the pin and the substrate by the conductive bonding object, and electrically connecting the pin and the transparent conductive layer by the conductive bonding object.