US2013299356A1PendingUtilityA1

Plating method using intaglio processing

Assignee: HYUNDAI MOTOR CO LTDPriority: May 11, 2012Filed: Dec 21, 2012Published: Nov 14, 2013
Est. expiryMay 11, 2032(~5.8 yrs left)· nominal 20-yr term from priority
Inventors:Chang-Sup Lee
C23F 1/00C23C 28/00C23C 18/16C25D 5/623C25D 5/48C25D 5/14C25D 5/627C25D 5/02C25D 5/40
45
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Claims

Abstract

Disclosed is a plating method using etching during surface treatment of a material, including: forming a nickel plating layer on the surface of an original material; masking a masking jig in a form of a plate on which a graphic is engraved on the nickel plating layer; etching the masked nickel plating layer; removing the masking jig from the nickel plating layer; and forming a chromium plating layer on the etched nickel plating layer, in which a desired graphic is engraved without deterioration of appearance, corrosion resistance, abrasion resistance and the like.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A plating method for covering a surface of a material with a metal by etching, comprising:
 forming a nickel plating layer on a surface of an original material;   masking a masking jig as a plate on which a graphic is engraved on the nickel plating layer;   etching the masked nickel plating layer;   removing the masking jig from the nickel plating layer; and   forming a chromium plating layer on the etched nickel plating layer.   
     
     
         2 . The method of  claim 1 , wherein the etching uses an acid treatment or sand blasting. 
     
     
         3 . The method of  claim 1 , wherein the forming a nickel plating layer further includes forming a copper plating layer on the surface of the original material, and forming a nickel plating layer on the copper plating layer. 
     
     
         4 . The method of  claim 1 , wherein the forming a chromium plating layer further includes forming a microporous nickel plating layer on the etched nickel plating layer, and forming a chromium plating layer on the microporous nickel plating layer. 
     
     
         5 . The method of  claim 4 , wherein the forming a nickel plating layer further includes forming a copper plating layer on the surface of the original material. 
     
     
         6 . The method of  claim 1 , wherein the nickel plating layer is selected from a group consisting of: a glossy nickel plating layer, a semi-glossy nickel plating layer, and a non-glossy nickel plating layer. 
     
     
         7 . The method of  claim 1 , wherein the nickel plating layer comprises a semi-glossy nickel plating layer and a glossy nickel plating layer formed on the semi-glossy nickel plating layer. 
     
     
         8 . The method of  claim 1 , wherein the nickel plating layer comprises a semi-glossy nickel plating layer and a non-glossy nickel plating layer formed on the semi-glossy nickel plating layer. 
     
     
         9 . The method of  claim 1 , wherein the nickel plating layer comprises a semi-glossy nickel plating layer a glossy nickel plating layer formed on the semi-glossy nickel plating layer and a non-glossy nickel plating layer formed on the glossy nickel plating layer. 
     
     
         10 . The method of  claim 1 , wherein the nickel plating layer comprises a semi-glossy nickel plating layer and a non-glossy nickel plating layer formed on the semi-glossy nickel plating layer and a glossy nickel plating layer formed on the non-glossy nickel plating layer.

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