US2013299356A1PendingUtilityA1
Plating method using intaglio processing
Est. expiryMay 11, 2032(~5.8 yrs left)· nominal 20-yr term from priority
Inventors:Chang-Sup Lee
C23F 1/00C23C 28/00C23C 18/16C25D 5/623C25D 5/48C25D 5/14C25D 5/627C25D 5/02C25D 5/40
45
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Claims
Abstract
Disclosed is a plating method using etching during surface treatment of a material, including: forming a nickel plating layer on the surface of an original material; masking a masking jig in a form of a plate on which a graphic is engraved on the nickel plating layer; etching the masked nickel plating layer; removing the masking jig from the nickel plating layer; and forming a chromium plating layer on the etched nickel plating layer, in which a desired graphic is engraved without deterioration of appearance, corrosion resistance, abrasion resistance and the like.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A plating method for covering a surface of a material with a metal by etching, comprising:
forming a nickel plating layer on a surface of an original material; masking a masking jig as a plate on which a graphic is engraved on the nickel plating layer; etching the masked nickel plating layer; removing the masking jig from the nickel plating layer; and forming a chromium plating layer on the etched nickel plating layer.
2 . The method of claim 1 , wherein the etching uses an acid treatment or sand blasting.
3 . The method of claim 1 , wherein the forming a nickel plating layer further includes forming a copper plating layer on the surface of the original material, and forming a nickel plating layer on the copper plating layer.
4 . The method of claim 1 , wherein the forming a chromium plating layer further includes forming a microporous nickel plating layer on the etched nickel plating layer, and forming a chromium plating layer on the microporous nickel plating layer.
5 . The method of claim 4 , wherein the forming a nickel plating layer further includes forming a copper plating layer on the surface of the original material.
6 . The method of claim 1 , wherein the nickel plating layer is selected from a group consisting of: a glossy nickel plating layer, a semi-glossy nickel plating layer, and a non-glossy nickel plating layer.
7 . The method of claim 1 , wherein the nickel plating layer comprises a semi-glossy nickel plating layer and a glossy nickel plating layer formed on the semi-glossy nickel plating layer.
8 . The method of claim 1 , wherein the nickel plating layer comprises a semi-glossy nickel plating layer and a non-glossy nickel plating layer formed on the semi-glossy nickel plating layer.
9 . The method of claim 1 , wherein the nickel plating layer comprises a semi-glossy nickel plating layer a glossy nickel plating layer formed on the semi-glossy nickel plating layer and a non-glossy nickel plating layer formed on the glossy nickel plating layer.
10 . The method of claim 1 , wherein the nickel plating layer comprises a semi-glossy nickel plating layer and a non-glossy nickel plating layer formed on the semi-glossy nickel plating layer and a glossy nickel plating layer formed on the non-glossy nickel plating layer.Join the waitlist — get patent alerts
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