Insulated thermal interface material

Abstract

The present invention discloses an insulated thermal interface material for applying between an electronic element and a thermal dissipating element. The insulated thermal interface material at least comprises a base, a first filler and a second filler. The base is a polymer and the first filler is graphene. The first filler and the second filler are dispersed in the base.

What is claimed is: 
     
         1 . An insulated thermal interface material for applying between an electronic element and a thermal dissipating element, the insulated thermal interface material at least comprising:
 a base composing of a polymer; and   a first filler and a second filler dispersing in the base,   wherein the first filler includes a graphene.   
     
     
         2 . The insulated thermal interface material according to  claim 1 , wherein the first filler includes the graphene with a length-to-thickness ratio or a width-to-thickness ratio of 50˜10000 and selected from a group consisting of a graphene, a graphene doped with nitrogen, a graphene doped with oxygen, a graphene doped with both nitrogen and oxygen, multilayer graphene stacking via van der Waals interaction, multilayer graphene doped with nitrogen and stacking via van der Waals interaction, multilayer graphene doped with oxygen stacking via van der Waals interaction and multilayer graphene doped with both nitrogen and oxygen stacking via van der Waals interaction. 
     
     
         3 . The insulated thermal interface material according to  claim 1 , wherein the second filler is a thermal conductive inorganic powder and selected from a group consisting of aluminum oxide, magnesium oxide, aluminum nitride, boron nitride, silicon carbide, tin oxide, silicon nitride, aluminum oxide whisker, aluminum nitride whisker, silicon carbide whisker, magnesium oxide whisker and silicon nitride whisker. 
     
     
         4 . The insulated thermal interface material according to  claim 1 , wherein the base is a silicone rubber and at least contains an organic polysiloxane compound, a curing agent and an adhesion promoter, the weight percentage of the organic polysiloxane compound, the curing agent, the adhesion promoter, the first filler and the second filler are 91-99.55%, 0.1-5%, 0.1-3%, 0.0025-0.005% and 0.25-0.5%, respectively. 
     
     
         5 . The insulated thermal interface material according to  claim 4 , wherein the second filler has an average granularity of 20˜50 μm. 
     
     
         6 . The insulated thermal interface material according to  claim 4 , wherein the organic polysiloxane compound has a degree of polymerization of 200˜12000 and is represented by the following formula:
   R 1   a SiO (4-a)/2    
 Wherein R 1  is a single-valence C 1 ˜C 10  hydrocarbon group and selected from a group consisting of an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, an alkyl group substituted by halogen and an alkenyl group, and “a” further represents a positive number of 1.9-2.05. 
 
     
     
         7 . The insulated thermal interface material according to  claim 4 , wherein the curing agent is an organic peroxide or a curing agent applying in an alkylation reaction of silane. 
     
     
         8 . The insulated thermal interface material according to  claim 4 , wherein the adhesion promoter at least comprises a silicon compound with a plurality of substitutes and the substitutes could be selected from a group consisting of a cyclalkyl group, an alkoxyl group, a methyl group, a vinyl group and a silane group. 
     
     
         9 . The insulated thermal interface material according to  claim 1 , wherein the base is a curing epoxy resin and selected from a group consisting of a linear polyepoxide with epoxide as an end group, a polyepoxide with epoxide at backbond and a polyepoxide with epoxide as side chain. 
     
     
         10 . The insulated thermal interface material according to  claim 9  further comprising a particulate thermoplastic polymer, wherein the weight percentage of the base, the particulate thermoplastic polymer, the first filler and the second filler are 90˜97%, 1˜2%, 0.001˜0.005% and 0.1˜1%, respectively. 
     
     
         11 . The insulated thermal interface material according to  claim 10 , wherein the particulate thermoplastic polymer comprises a polymer with a glass transition temperature of at least 60° C. 
     
     
         12 . The insulated thermal interface material according to  claim 10 , wherein the particulate thermoplastic polymer comprises has an average molecular weight higher than 7000. 
     
     
         13 . The insulated thermal interface material according to  claim 10 , wherein the particulate thermoplastic polymer is selected from a group consisting of a poly(methyl methacrylate) and a methyl methacrylate/methacrylic acid copolymer. 
     
     
         14 . The insulated thermal interface material according to  claim 10 , wherein the particulate thermoplastic polymer has an average granularity of 0.25˜250 μm. 
     
     
         15 . The insulated thermal interface material according to  claim 9  further comprising a curing agent, and the curing agent contains a dicyandiamide and its derivatives or a metal imidazole compound represented by the following formula:
   ML m    
 wherein M is a metal and selected from a group consisting of Ag (I), Cu (I), Cu (II), Cd (II), Zn (II), Hg (II), Ni (II) and Co (II), and L is a compound represented by the following formula: 
 
       
         
           
           
               
               
           
         
         wherein R 1 , R 2 and R 3  could be selected from a group consisting of hydrogen atom, alkyl group and aryl group, and m is the valence of metal. 
       
     
     
         16 . The insulated thermal interface material according to  claim 1 , wherein the thermal conductivity of the insulated thermal interface material is higher than 3 W/mK. 
     
     
         17 . The insulated thermal interface material according to  claim 1  further comprising an additive, and the additive could be selected from a group consisting of coupling agent, lubricant, flow controlling agent, thickener, accelerant, chain-extenders, flexibilizer, dispersant and co-curing agent.