Electroless copper plating bath and electroless copper plating method

Abstract

Provided are an electroless copper plating bath and an electroless copper plating method using the electroless copper plating bath, the electroless copper plating bath not containing formaldehyde; being usable under approximately neutral pH conditions; improving plating bath stability; and capable of forming a plating film with a good thickness while controlling deposition outside a pattern. The electroless copper plating bath according to the present invention contains a water-soluble copper salt, and amine borane or a substituted derivative thereof as a reducing agent; does not contain formaldehyde; and has a pH of 4 to 9, wherein polyaminopolyphosphonic acid as a complexing agent, an anionic surface-active agent, an antimony compound, and a nitrogen-containing aromatic compound are contained.

What is claimed is: 
     
         1 . An electroless copper plating bath, comprising a water-soluble copper salt, and amine borane or a substituted derivative thereof as a reducing agent;
 not comprising formaldehyde; and having a pH of 4 to 9, wherein polyaminopolyphosphonic acid as a complexing agent, an anionic surface active agent, an antimony compound, and a nitrogen-containing aromatic compound are comprised.   
     
     
         2 . The electroless copper plating bath according to  claim 1 , wherein a concentration of the polyaminopolyphosphonic acid is 0.01 to 1 mol/L. 
     
     
         3 . The electroless copper plating bath according to  claim 1 , wherein a concentration of the anionic surface active agent is 0.01 to 2000 mg/L. 
     
     
         4 . The electroless copper plating bath according to  claim 1 , wherein a concentration of the antimony compound is 0.1 to 20 mg/L. 
     
     
         5 . The electroless copper plating bath according to  claim 1 , wherein a concentration of the nitrogen-containing aromatic compound is 0.01 to 1000 mg/L. 
     
     
         6 . An electroless copper plating method, wherein a copper plating film is formed on a base material by using the electroless copper plating bath according to  claim 1 . 
     
     
         7 . The electroless copper plating method according to  claim 6 , wherein the base material is made of aluminum or aluminum alloy, or magnesium or magnesium alloy.