US2013292094A1PendingUtilityA1
Heat Dissipating Device
Assignee: MICROTIPS ELECTRONICS CO LTDPriority: May 2, 2012Filed: Apr 30, 2013Published: Nov 7, 2013
Est. expiryMay 2, 2032(~5.8 yrs left)· nominal 20-yr term from priority
F28D 15/0233F28D 15/0275F28F 1/16F28F 2255/16F28D 15/025F28F 1/022F28F 1/003F28F 21/084
54
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Claims
Abstract
A heat dissipating device includes an outer heat conducting unit, disposed with outer heat conducting plates, and an inner heat conducting unit. The outer heat conducting unit includes an outer surrounding wall having inner and outer wall surfaces. The inner wall surface defines a space. The outer surrounding wall further has an opening sealed by a cover. The inner heat conducting unit is formed as a separate component from the outer heat conducting unit, is received in the space, and is in thermal contact with the inner wall surface of the outer surrounding wall.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A heat dissipating device comprising:
an outer heat conducting unit including an outer surrounding wall having an inner wall surface and an outer wall surface, said inner wall surface defining a space, said outer surrounding wall further having a first opening, said outer heat conducting unit further including a first cover 32 to seal said first opening; a plurality of outer heat conducting plates spacedly disposed on and extending away from said outer wall surface; and an inner heat conducting unit formed as a separate component from said outer heat conducting unit, received in said space, and in thermal contact with said inner wall surface of said surrounding wall.
2 . The heat dissipating device as claimed in claim 1 , wherein said first cover has a retaining portion extending towards said inner heat conducting unit.
3 . The heat dissipating device as claimed in claim 1 , wherein said inner heat conducting unit includes an inner surrounding wall corresponding in shape to said inner wall surface of said outer surrounding wall, a plurality of inner heat conducting plates spacedly disposed in and connected to said inner surrounding wall, and a plurality of flow channels cooperatively defined by said inner surrounding wall and said inner heat conducting plates;
said inner surrounding wall being welded to said inner wall surface of said outer surrounding wall, and said inner heat conducting plates extending in a direction away from said first cover.
4 . The heat dissipating device as claimed in claim 3 , wherein said space of said outer heat conducting unit has a form of a blind hole.
5 . The heat dissipating device as claimed in claim 3 , wherein said outer surrounding wall further has a second opening opposite to said first opening, said outer heat conducting unit further including a second cover to seal said second opening, said inner heat conducting plates extending in a direction from said first opening towards said second opening, said second cover having a retaining portion extending toward said inner heat conducting unit.
6 . The heat dissipating device as claimed in claim 3 , wherein said outer wall surface of said outer surrounding wall has a contact portion for contacting a heat source, said outer heat conducting plates being disposed on a region of said outer wall surface of said outer surrounding wall other than said contact portion.
7 . The heat dissipating device as claimed in claim 3 , wherein said inner heat conducting unit has surfaces that define said flow channels and that are serrated surfaces.
8 . The heat dissipating device as claimed in claim 1 , wherein said inner heat conducting unit includes an inner surrounding wall, and a plurality of inner heat conducting plates spacedly disposed on said inner surrounding wall and welded to said outer surrounding wall, said inner heat conducting plates extending in a direction away from said first cover, said inner surrounding wall and said inner heat conducting plates cooperating with said outer surrounding wall to define a plurality of flow channels.
9 . The heat dissipating device as claimed in claim 8 , wherein at least one of said outer heat conducting plates and said inner heat conducting plates is a curved plate.
10 . The heat dissipating device as claimed in claim 1 , wherein said inner heat conducting unit includes an inner surrounding wall, a plurality of inner heat conducting plates spacedly disposed on said inner surrounding wall and extending towards said outer surrounding wall, a surrounding plate surrounding and connected to said inner heat conducting plates, and a plurality of flow channels cooperatively defined by said inner surrounding wall, said surrounding plate and said inner heat conducting plates;
said surrounding plate corresponding in shape to said inner wall surface of said outer surrounding wall and being welded to said inner wall surface of said outer surrounding wall, and said inner heat conducting plates extending in a direction away from said first cover.
11 . The heat dissipating device as claimed in claim 10 , wherein at least one of said outer heat conducting plates and said inner heat conducting plates is a curved plate.Join the waitlist — get patent alerts
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