Heat Dissipating Device

Abstract

A heat dissipating device includes a heat conducting member and a coolant storing unit. The heat conducting member includes a surrounding wall that defines an internal space and that is adapted to be placed in contact with a heat source, and a plurality of heat conducting plates that are spacedly disposed in the internal space, that are connected to the surrounding wall, and that cooperate with the surrounding wall to define a plurality of flow channels. The coolant storing unit stores a coolant and is in fluid connection with the heat conducting member. The flow channels extend upwardly, and the coolant flows along the flow channels when the heat of the heat source is transmitted to the coolant.

What is claimed is: 
     
         1 . A heat dissipating device for dissipating heat from a heat source, said heat dissipating device comprising:
 a heat conducting unit including a heat conducting member made from a heat conducting material, said heat conducting member including a surrounding wall that defines an internal space and that is adapted to be placed in contact with the heat source, and a plurality of heat conducting plates that are spacedly disposed in said internal space, that are connected to said surrounding wall, and that cooperate with said surrounding wall to define a plurality of flow channels; and   a coolant storing unit for storing a coolant and in fluid connection with said heat conducting member;   wherein said heat conducting unit is disposed to extend upwardly such that said flow channels extend upwardly, and said coolant flows along said flow channels of said heat conducting unit when the heat of the heat source is transmitted to said coolant through said heat conducting unit.   
     
     
         2 . The heat dissipating device as claimed in  claim 1 ,
 wherein said coolant storing unit includes two modules in fluid connection with each other, each of said modules including a first coolant storage member, a second coolant storage member, a plurality of conduit members fluidly connecting said first coolant storage member and said second coolant storage member, and a plurality of heat dissipating fins connected between adjacent pairs of said conduit members;   wherein said first coolant storage members of said two modules are in fluid connection with each other.   
     
     
         3 . The heat dissipating device as claimed in  claim 2 ,
 wherein said first coolant storage members of said two modules are disposed side by side with each other, and a distance between said second coolant storage members of said two modules is greater than a distance between said first coolant storage members of said two modules;   wherein each of said flow channels of said heat conducting member has a lower end in fluid connection with said second coolant storage member of one of said two modules, and an upper end in fluid connection with said second coolant storage member of the other one of said two modules; and   wherein said heat conducting member extends between said second coolant storage members of said two modules and cooperates with said coolant storing unit to configure said heat dissipating device to have a substantially triangular shape.   
     
     
         4 . The heat dissipating device as claimed in  claim 2 ,
 wherein said first coolant storage members of said two modules are disposed side by side with each other, and a distance between said second coolant storage members of said two modules is greater than a distance between said first coolant storage members of said two modules;   wherein each of said flow channels of said heat conducting member has a lower end in fluid connection with said first coolant storage member of one of said two modules, and said heat conducting unit is disposed to extend upwardly from said first coolant storage member of said one of said two modules and cooperates with said coolant storing unit to configure said heat dissipating device to have a substantially inverted Y shape; and   wherein each of said flow channels of said heat conducting member further has an upper end, and said heat conducting member further includes a cover body disposed to seal said upper ends of said flow channels of said heat conducting member, said cover body having a groove in fluid connection with said flow channels.   
     
     
         5 . The heat dissipating device as claimed in  claim 4 , wherein said heat conducting member further includes a plurality of heat dissipating plates extending outwardly from said surrounding wall. 
     
     
         6 . The heat dissipating device as claimed in  claim 8 , wherein said heat conducting unit further includes a fan disposed on said heat dissipating plates. 
     
     
         7 . The heat dissipating device as claimed in  claim 1 ,
 wherein said coolant storing unit includes a module, said module including a first coolant storage member, a second coolant storage member, and a plurality of conduit members fluidly connecting said first coolant storage member and said second coolant storage member;   wherein said first coolant storage member is disposed above said second coolant storage member;   wherein each of said flow channels of said heat conducting member has a lower end in fluid connection with said first coolant storage member, and said heat conducting unit is disposed to extend upwardly from said first coolant storage member; and   wherein each of said flow channels of said heat conducting member further has an upper end, and said heat conducting member further includes a cover body disposed to seal said upper ends of said flow channels of said heat conducting member, said cover body having a groove in fluid connection with said flow channels.   
     
     
         8 . The heat dissipating device as claimed in  claim 5 , wherein said heat conducting member further includes a plurality of heat dissipating plates extending outwardly from said surrounding wall. 
     
     
         9 . The heat dissipating device as claimed in  claim 6 , wherein said heat conducting unit further includes a fan disposed on said heat dissipating plates.