Sputtering Target for Oxide Thin Film and Process for Producing the Sputtering Target

Abstract

Disclosed is a sputtering target that can suppress the occurrence of anomalous discharge in the formation of an oxide semiconductor film by sputtering method and can continuously and stably form a film. Also disclosed is an oxide for a sputtering target that has a rare earth oxide C-type crystal structure and has a surface free from white spots (a poor appearance such as concaves and convexes formed on the surface of the sputtering target). Further disclosed is an oxide sintered compact that has a bixbyite structure and contains indium oxide, gallium oxide, and zinc oxide. The composition amounts (atomic %) of indium (In), gallium (Ga), and zinc (Zn) fall within a composition range satisfying the following formula: In/(In+Ga+Zn)<0.75

1 .- 9 . (canceled) 
     
     
         10 . An oxide sintered body comprising In(indium) in an amount of 24 to 49 atom % based on the atomicity of all the atoms included in oxides at issue other than oxide as 100 atom %, and having a crystalline structure of rare-earth oxide C type. 
     
     
         11 . The oxide sintered body of  claim 10  comprising In(indium) in an amount of 24 to 49 atom %, Ga (gallium) in an amount of 10 to 49 atom %, and Zn (zinc) in an amount of 5 to 65 atom % based on the atomicity of all the atoms included in oxides at issue other than oxide as 100 atom %, and having a crystalline structure of rare-earth oxide C type. 
     
     
         12 . The oxide sintered body of  claim 10 , in which a part of In constructing said crystalline structure of rare-earth oxide C type is subjected to solid solution substitution by a metal element (X) having positive four or more valences. 
     
     
         13 . The oxide sintered body of  claim 10  having said crystalline structure of rare-earth oxide C type in which an average crystalline particle diameter is 20 μm or less. 
     
     
         14 . The oxide sintered body of  claim 10  in which relative density is 80% or more. 
     
     
         15 . The oxide sintered body of  claim 10  in which relative density is 90% or more. 
     
     
         16 . The oxide sintered body of  claim 10  in which bulk resistance is in a range of 0.1 to 100 mΩ·cm. 
     
     
         17 . The oxide sintered body of  claim 10  in which bulk resistance is 1×10 −2  Ωcm or less. 
     
     
         18 . The oxide sintered body of  claim 10  in which lattice constant a is a<10.12 Å. 
     
     
         19 . The oxide sintered body of  claim 12 , comprising a metal element (X) having positive four or more valences in an amount of 10 to 10000 ppm based on the atomicity of all the atoms other than oxide as 100 atom %. 
     
     
         20 . The oxide sintered body of  claim 12 , in which said metal element (X) having positive four or more valences is subjected to solid solution substitution at a ratio of (the metal element (X) having positive four or more valences)/(all the metal elements in the oxide sintered body)=100 ppm to 10000 ppm. 
     
     
         21 . The oxide sintered body of  claim 19 , in which said metal element (X) having positive four or more valences is one or more elements selected from the group consisting of tin, zirconium, germanium, cerium, niobium, tantalum, molybdenum, tungsten, and titanium. 
     
     
         22 . A sputtering target composed of the oxide sintered body of  claim 10 . 
     
     
         23 . A method for preparing the oxide sintered body of  claim 14  comprising the following steps;
 (a) mixing a crude oxide powder; 
 (b) forming the obtained mixture; and 
 (c) sintering the obtained formed body at 1200° C. or more and less than 1600° C. 
 
     
     
         24 . A method for preparing the oxide sintered body of  claim 14  comprising the following steps;
 (a) mixing a crude oxide powder; 
 (b) forming the obtained mixture; and 
 (c) sintering the obtained formed body at 1200° C. or more and 1400° C. or less. 
 
     
     
         25 . A method for preparing the oxide sintered body of  claim 10  comprising the following steps;
 (a) mixing a crude oxide powder; 
 (b) forming the obtained mixture; and 
 (c) sintering the obtained formed body at 1450° C. or more and less than 1600° C. 
 
     
     
         26 . An oxide thin film formed by a sputtering method using said sputtering target of  claim 22 . 
     
     
         27 . A method for forming an amorphous oxide thin film having electric carrier concentration of less than 1×10 18 /cm 3 , in which said method comprises a step of conducting sputtering using the sputtering target of  claim 22  at a film forming temperature from 25 to 450° C. 
     
     
         28 . The method of  claim 27  wherein the amorphous oxide thin film is a thin film used for a channel layer of a thin film transistor. 
     
     
         29 . A method for producing a thin film transistor containing an amorphous oxide thin film and an oxide insulation layer, comprising the steps of
 (i) heat-treating the amorphous oxide thin film formed by the method of  claim 27  within oxidation atmosphere; and   (ii) forming the oxide insulation layer on the heat-treated amorphous oxide thin film.   
     
     
         30 . A semi-conductor device having the thin film transistor prepared by the method for producing a thin film transistor of  claim 29 .