Opto-electronic modules and methods of manufacturing the same and appliances and devices comprising the same

Abstract

Manufacturing opto-electronic modules ( 1 ) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack ( 2 ) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules ( 1 ) can be obtained by separating the wafer stack ( 2 ) into separate modules.

1 . (canceled) 
     
     
         2 . A proximity sensor module comprising:
 a substrate on which are mounted a light emitter and a light detector;   an optics member disposed over the substrate and substantially parallel to the substrate;   a plurality of passive optical components disposed over the light emitter on opposite sides of the optics member from one another;   a plurality of passive optical components disposed over the light detector on opposite sides of the optics member from one another;   a baffle member over the optics member;   an interior wall at least partially separating an area of the module into which the light emitter emits light from an area of the module from which the light detector detects light, wherein the interior wall is composed of a material that is substantially non-transparent to light detectable by the light detector; and   outside walls of the module, wherein at least part of the outside walls are composed of a material that is substantially non-transparent to light detectable by the light detector.   
     
     
         3 . The proximity sensor module of  claim 2  wherein each of the plurality of passive optical components over the light emitter and the plurality of passive optical components over the light detector comprises a lens. 
     
     
         4 . The proximity sensor module of  claim 2  including a spacer between the substrate and the optics member. 
     
     
         5 . The proximity sensor module of  claim 4  wherein the spacer encircles the light emitter and the light detector. 
     
     
         6 . The proximity sensor module of  claim 5  wherein the substrate and the optics member are fixed to one another via the spacer. 
     
     
         7 . The proximity sensor module of  claim 4  wherein the spacer has a plurality of openings, wherein the light emitter is arranged in one of the openings and the light detector is arranged in another one of the openings. 
     
     
         8 . The proximity sensor module of  claim 2  wherein the interior wall includes a polymer material. 
     
     
         9 . The proximity sensor module of  claim 8  wherein at least parts of the outside walls of the module include the same polymer material as the interior wall. 
     
     
         10 . The proximity sensor module of  claim 9  wherein the baffle member is composed of an epoxy material. 
     
     
         11 . The proximity sensor module of  claim 2  wherein at least parts of the outside walls of the module include a polymer material. 
     
     
         12 . The proximity sensor module of  claim 2  wherein the baffle member is composed of an epoxy material. 
     
     
         13 . The proximity sensor module of  claim 2  wherein the light emitter is a light emitting diode and the light detector is a photodiode. 
     
     
         14 . The proximity sensor module of  claim 13  wherein the light emitting diode is disposed on the substrate so as to emit light in a direction generally perpendicular to the substrate. 
     
     
         15 . The proximity sensor module of  claim 2  wherein the passive optical components over the light emitter and the passive optical components over the light detector are composed of a resin material. 
     
     
         16 . An opto-electronic sensor module comprising:
 a substrate on which are mounted a light emitting diode and a photodiode, the light emitting diode disposed to emit light in a direction substantially perpendicular to a surface of the substrate on which the light emitting diode is mounted;   an optics member disposed over the substrate and substantially parallel to the substrate;   a plurality of lenses disposed over the light emitting diode on opposite sides of the optics member from one another;   a plurality of lenses disposed over the photodiode on opposite sides of the optics member from one another;   a baffle member over the optics member and having openings over the lenses;   an interior wall at least partially separating an area of the module into which the light emitting diode emits light from an area of the module from which the photodiode detects light, wherein the interior wall is composed of a material that is substantially non-transparent to light detectable by the photodiode; and   respective electrical contacts for the light emitting diode and the photodiode are connected to contacts on an outside surface of the module.   
     
     
         17 . The opto-electronic sensor module of  claim 16  including outside walls of the module, wherein at least part of the outside walls are composed of a material that is substantially non-transparent to light detectable by the photodiode. 
     
     
         18 . The opto-electronic sensor module of  claim 17  wherein at least parts of the outside walls of the module include a polymer material, wherein the interior wall includes a polymer material, wherein the baffle member is composed of an epoxy material, and wherein the lenses over the light emitter and the lenses over the light detector are composed of a resin material. 
     
     
         19 . The opto-electronic sensor module of  claim 18  wherein at least portions of the optics member on which the lenses are disposed are composed of a material substantially transparent to light emitted by the light emitting diode and detectable by the photodiode. 
     
     
         20 . The opto-electronic sensor module of  claim 16  wherein the contacts on the outside surface of the module are on an outside surface of the substrate. 
     
     
         21 . The opto-electronic sensor module of  claim 20  wherein the contacts are contact pads. 
     
     
         22 . The opto-electronic sensor module of  claim 16  including a separation member between the substrate and the optics member. 
     
     
         23 . The opto-electronic sensor module of  claim 22  wherein the separation member encircles the light emitting diode and the photodiode. 
     
     
         24 . The opto-electronic sensor module of  claim 23  wherein the substrate and the baffle member are fixed to one another via the separation member. 
     
     
         25 . The opto-electronic sensor module of  claim 22  wherein the separation member has a plurality of openings, wherein the light emitting diode is arranged in one of the openings and the photodiode is arranged in another one of the openings. 
     
     
         26 . The opto-electronic sensor module of  claim 16  wherein at least either the interior wall or at least part of the outside walls of the module are composed of a polymer material. 
     
     
         27 . The opto-electronic sensor module  16  wherein the baffle member is composed of an epoxy material. 
     
     
         28 . A hand-held communication device comprising:
 a printed circuit board; and   a proximity sensor module mounted on the printed circuit board, the proximity sensor module including:
 a substrate on which are mounted a light emitter and a light detector; 
 an optics member disposed over the substrate and substantially parallel to the substrate; 
 a plurality of passive optical components disposed over the light emitter on opposite sides of the optics member from one another; 
 a plurality of passive optical components disposed over the light detector on opposite sides of the optics member from one another; 
 a baffle member over the optics member; and 
 an interior wall at least partially separating an area of the module into which the light emitter emits light from an area of the module from which the light detector detects light, wherein the interior wall is composed of a material that is substantially non-transparent to light detectable by the light detector. 
   
     
     
         29 . The hand-held communication device of  claim 28  wherein each of the plurality of passive optical components over the light emitter and the plurality of passive optical components over the light detector comprises a lens. 
     
     
         30 . The hand-held communication device of  claim 28  wherein the proximity sensor module includes a spacer between the substrate and the optics member, wherein the spacer encircles the light emitter and the light detector, and wherein the substrate and the baffle member are fixed to one another via the spacer. 
     
     
         31 . The hand-held communication device of  claim 28  the proximity sensor includes outer walls, at least parts of which are composed of a material that is substantially non-transparent to light detectable by the light detector, and wherein the passive optical components over the light emitter and the passive optical components over the light detector are composed of a resin material.