Positive-type photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device including the cured film

Abstract

A positive-type photosensitive resin composition includes (A) an alkali-soluble resin, (B) a photosensitizer, and (C) a silicon compound shown by the following general formula (1). R 1 represents an alkylene group having 6 to 8 carbon atoms, and R 2 represents an alkyl group having 1 to 10 carbon atoms. The positive-type photosensitive resin composition exhibits excellent storage stability, produces a film that exhibits excellent adhesion to a substrate during development, and produces a cured film that exhibits excellent adhesion to a substrate after humidification. (R 2 O) 3 —Si—R 1 —Si—(OR 2 ) 3   (1)

1 . A positive-type photosensitive resin composition comprising (A) an alkali-soluble resin, (B) a photosensitizer, and (C) a silicon compound shown by the following general formula (1),
   (R 2 O) 3 —Si—R 1 —Si—(OR 2 ) 3   (1)
   wherein R 1  represents an alkylene group having 6 to 8 carbon atoms, and R 2  represents an alkyl group having 1 to 10 carbon atoms.   
     
     
         2 . The positive-type photosensitive resin composition according to  claim 1 , wherein the alkali-soluble resin (A) includes a polyamide resin that includes a repeating unit shown by the following general formula (2), 
       
         
           
           
               
               
           
         
         wherein X and Y represent an organic group, R 3  individually represents —O—R 5 , an alkyl group, an acyloxy group, or a cycloalkyl group, R 4  individually represents a hydroxyl group, a carboxyl group, —O—R 5 , or —COO—R 5 , h is an integer from 0 to 8, i is an integer from 0 to 8, and R 5  represents an organic group having 1 to 15 carbon atoms, provided that R 3  may be the same or different when h is an integer equal to or larger than 2, R 4  may be the same or different when i is an integer equal to or larger than 2, at least one R 4  represents a carboxyl group when R 3  does not represent a hydroxyl group, and at least one R 3  represents a hydroxyl group when R 4  does not represent a carboxyl group. 
       
     
     
         3 . The positive-type photosensitive resin composition according to  claim 2 , wherein X in the general formula (2) is at least one of structures shown by the following formulas (3-1) to (3-6), 
       
         
           
           
               
               
           
         
         wherein the asterisk (*) represents the NH group, D represents —CH 2 —, —CH(CH 3 )—, —C(CH 3 ) 2 —, —O—, —S—, —SO 2 —, —CO—, —NHCO—, —C(CF 3 ) 2 —, or a single bond, E represents —CH 2 —, —CH(CH 3 )—, or —C(CH 3 ) 2 —, R 6  individually represent an alkyl group, an alkoxy group, an acyloxy group, or a cycloalkyl group, and g is an integer from 1 to 3. 
       
     
     
         4 . The positive-type photosensitive resin composition according to  claim 1 , wherein the content of the silicon compound (C) is 0.05 to 50 parts by weight based on 100 parts by weight of the alkali-soluble resin (A). 
     
     
         5 . A cured film comprising a cured product of the positive-tone photosensitive resin composition according to  claim 1 . 
     
     
         6 . A protective film comprising the cured film according to  claim 5 . 
     
     
         7 . An insulating film comprising the cured film according to  claim 5 . 
     
     
         8 . A semiconductor device comprising the cured film according to  claim 5 . 
     
     
         9 . A display device comprising the cured film according to  claim 5 .