Drug delivery chip and fabricating method thereof
Abstract
A drug-delivery chip and a method of fabricating the same are provided. The drug-delivery chip has a main body having at least one drug receiving space individually formed with an opening for storing drugs therein; a thin film for sealing up the at least one drug receiving space; a first conductive wire connecting to one end of the thin film; a second conductive wire connecting to another end of the thin film; a signal-receiving module for receiving actuated signals; and a control module for applying voltages to first and second wire conductive s according to the actuated signal, thereby generating heat to break off the thin film for the release of a drug or drugs received in the at least one drug receiving space.
Claims
exact text as granted — not AI-modified1 . A drug-delivery chip, comprising:
a main body having at least one drug receiving space individually formed with an opening; a thin film for sealing up the opening of the at least one drug receiving space; a first conductive wire connected to one end of the thin film; a second conductive wire connected to another end of the thin film; a signal-receiving module for receiving actuated signals; and a control module for applying voltages to the first conductive wire and the second conductive wire according to the actuated signals, thereby generating heat to break off the thin film for releasing a drug received in the at least one receiving space from the opening.
2 . The drug-delivery chip of claim 1 , wherein the actuated signals include check codes for the control module to identify whether the actuated signals are valid.
3 . The drug-delivery chip of claim 1 , wherein the thin film is a metal thin film.
4 . The drug-delivery chip of claim 3 , further comprising a plurality of drug receiving spaces and a plurality of switching units which are electrically connected to the control module and connected in one-to-one manner to the first conductive wires and the second conductive wires which are connected to the metal thin films sealing up the openings of the drug receiving spaces, wherein the actuated signals comprise address codes and the control module correspondingly turns on one of the switching units according to the address codes of the actuated signals so as to supply power to the first conductive wire and the second connective wire electrically connected to the turned-on one of the switching units, enabling the metal thin film connected to the first conductive wire and the second connective wire supplied with the power to be broken off, and allowing the one of the drug receiving spaces corresponding to the broken-off metal thin film to release the drug from the opening thereof.
5 . The drug-delivery chip of claim 4 , wherein the actuated signals further comprise check codes for the control module to identify whether the actuated signals are valid.
6 . The drug-delivery chip of claim 3 , wherein the resistance of the metal thin film is greater than the resistance of the first conductive wire or the second conductive wire.
7 . The drug-delivery chip of claim 1 being a system-on-a-chip (SoC) fabricated by a CMOS process.
8 . A drug-delivery chip, comprising:
a main body having at least one drug receiving space individually formed with an opening; a first conductive wire connected to a side wall of the at least one drug receiving space; a second conductive wire connected to another side wall of the at least one drug receiving space and spaced from the first conductive wire; a thin film for sealing up the opening of the at least one drug receiving space; a signal-receiving module for receiving actuated signals; and a control module for applying voltages to the first conductive wire and the second conductive wire according to the actuated signals, thereby electrolyzing a drug received in the at least one drug receiving space and generating air to break off the thin film for releasing the drug from the opening of the at least one receiving space.
9 . The drug-delivery chip of claim 8 , wherein the side wall of the at least one drug receiving space connected to the first conductive wire is identical to the another side wall of the at least one drug receiving space connected to the second conductive wire.
10 . The drug-delivery chip of claim 8 , wherein the side wall of the at least one drug receiving space connected to the first conductive wire is opposed to the another side wall of the at least one drug receiving space connected to the second conductive wire.
11 . The drug-delivery chip of claim 8 , wherein the actuated signals comprise check codes for the control module to identify whether the actuated signals are valid.
12 . The drug-delivery chip of claim 8 , wherein the thin film is a protection layer of the drug-delivery chip.
13 . The drug-delivery chip of claim 12 , further comprising a plurality of drug receiving spaces and a plurality of switching units which are electrically connected to the control module and connected in one-to-one manner to the first conductive wires and the second conductive wires installed on either of the side walls of the drug receiving spaces, wherein the actuated signals comprise address codes and the control module correspondingly turns on one of the switching units according to the address codes of the actuated signals so as to supply power to the first conductive wire and the second connective wire electrically connected to the turned-on one of the switching units, enabling the protection layer to be broken off, and allowing the drug receiving spaces corresponding to the broken-off protection layer to release the drug.
14 . The drug-delivery chip of claim 13 , wherein the actuated signals further comprise check codes for the control module to identify whether the actuated signals are valid.
15 . The drug-delivery chip of claim 8 being an SoC fabricated by a CMOS process.
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