Semiconductor device and manufacturing method thereof

Abstract

A technology with which the reliability of a package making up a semiconductor device can be enhanced is provided. A feature of the technical idea of the invention is that: a heat sink unit and an outer lead unit are separated from each other; and the outer lead unit is provided with chip placement portions and each of the chip placement portions and each heat sink are joined together. As a result, when a sealing body is formed at a resin sealing step, tying portions function as a stopper for preventing resin leakage and the formation of resin burr in a package product can be thereby prevented. In addition, camber does not occur in the heat sink unit and cracking in a sealing body caused by winding (camber) can be suppressed.

What is claimed is: 
     
         1 . A manufacturing method of a semiconductor device comprising the steps of:
 (a) preparing a first frame in which a plurality of heat sinks are tied together through tying portions;   (b) preparing a second frame in which a plurality of lead portions each having a plurality of leads and a chip placement portion are tied together;   (c) forming the second frame so that the front surface of each the chip placement portion is positioned lower than the front surfaces of the leads;   (d) placing a semiconductor chip over the front surface of each the chip placement portion;   (e) electrically coupling together each the semiconductor chip and the leads; and   (f) sealing part of each the heat sink, part of each the lead portion, and each the semiconductor chip,   wherein the step (f) includes the steps of:   (f1) positioning and setting the first frame and the second frame in molding dies so that each the chip placement portion overlaps with each the heat sink from above as viewed in a plane,   (f2) filling resin in the molding dies using the tying portions formed in the first frame as a resin stopper; and   (f3) taking the molded first frame and second frame out of the molding dies.   
     
     
         2 . The manufacturing method of a semiconductor device according to  claim 1 ,
 wherein at the step (f1), the first frame and the second frame are positioned and set in molding dies so that a gap exists between each the heat sink and each the chip placement portion.   
     
     
         3 . A manufacturing method of a semiconductor device comprising the steps of:
 (a) preparing a first frame in which a plurality of heat sinks are tied together through tying portions;   (b) preparing a second frame in which a plurality of lead portions each having a plurality of leads and a chip placement portion are tied together;   (c) forming the second frame so that the front surface of each the chip placement portion is positioned lower than the front surfaces of the leads;   (d) placing a semiconductor chip over the front surface of each the chip placement portion;   (e) placing the second frame over the first frame so that each the chip placement portion with the semiconductor chip placed thereover is placed over each the heat sink;   (f) electrically coupling together each the semiconductor chip and the leads; and   (g) sealing part of each the heat sink, part of each the lead portion, and each the semiconductor chip,   wherein the step (g) includes the steps of:   (g1) setting the first frame and the second frame in molding dies;   (g2) filling resin in the molding dies using the tying portions formed in the first frame as a resin stopper; and   (g3) taking the molded first frame and second frame out of the molding dies.   
     
     
         4 . The manufacturing method of a semiconductor device according to  claim 3 ,
 wherein the step (f) is carried out after the step (d) and the step (e) are carried out.   
     
     
         5 . The manufacturing method of a semiconductor device according to  claim 3 ,
 wherein the step (f) is carried out after the step (d) before the step (e).